Cost-effective "BARC/resist-via-fill free" integration technology for 0.13 /spl mu/m Cu/low-k
Soo-Geun Lee, Kyoung-Woo Lee, Il-Goo Kim, Wan-Jae Park, Young-Jin Wee, Won-Sang Song, Jae-Hak Kim, Seung-Jin Lee, Hyeok-Sang Oh, Yong-Tak Lee, Joo-Hyuk Chung, Ho-kyu Kang, Kwang-Pyuk Suh
Published in Digest. International Electron Devices Meeting (2002)
Published in Digest. International Electron Devices Meeting (2002)
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Conference Proceeding
Alleviating electromigration through re-engineering the interface between Cu & dielectric-diffusion-barrier in 90 nm Cu/SiOC (k=2.9) device
Young Jin Wee, Soo Geun Lee, Won Sang Song, Kyoung-Woo Lee, Nam Hyung Lee, Ja Eung Ku, Ki-Kwan Park, Seung Jin Lee, Jae Hak Kim, Joo Hyuk Chung, Hong Jae Shin, Sang Rok Hah, Ho-Kyu Kang, Gwang Pyuk Suh
Published in IEEE International Electron Devices Meeting 2003 (2003)
Published in IEEE International Electron Devices Meeting 2003 (2003)
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Method of forming self-aligned silicide in semiconductor device
KU JA-HUM, LEE SOO-GEUN, KIM CHUL-SUNG, LEE EUNG-JOON, CHUNG JOO-HYUK, SEO TAE-WOOK
Year of Publication 11.12.2001
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Year of Publication 11.12.2001
Patent
Cost-effective BARC/resist-via-fill free integration technology for 0.13μm Cu/low-k
LEE, Soo-Geun, LEE, Kyoung-Woo, CHUNG, Joo-Hyuk, KANG, Ho-Kyu, SUH, Kwang-Pyuk, KIM, Il-Goo, PARK, Wan-Jae, WEE, Young-Jin, SONG, Won-Sang, KIM, Jae-Hak, LEE, Seung-Jin, OH, Hyeok-Sang, LEE, Yong-Tak
Year of Publication 2002
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Year of Publication 2002
Conference Proceeding