Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits
Budiman, A.S., Shin, H.-A.-S., Kim, B.-J., Hwang, S.-H., Son, H.-Y., Suh, M.-S., Chung, Q.-H., Byun, K.-Y., Tamura, N., Kunz, M., Joo, Y.-C.
Published in Microelectronics and reliability (01.03.2012)
Published in Microelectronics and reliability (01.03.2012)
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Journal Article
On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology
Tian, Tian, Morusupalli, R., Shin, H., Son, H.-Y., Byun, K.-Y., Joo, Y.-C., Caramto, R., Smith, L., Shen, Y-L., Kunz, M., Tamura, N., Budiman, A.S.
Published in Procedia engineering (2016)
Published in Procedia engineering (2016)
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Journal Article
Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy
Kim, S.-H., Sohn, H.-J., Joo, Y.-C., Kim, Y.-W., Yim, T.-H., Lee, H.-Y., Kang, T.
Published in Surface & coatings technology (01.09.2005)
Published in Surface & coatings technology (01.09.2005)
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Journal Article
Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment
Budiman, A.S., Besser, P.R., Hau-Riege, C.S., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.
Published in Journal of electronic materials (01.03.2009)
Published in Journal of electronic materials (01.03.2009)
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Journal Article
Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air
Jung, J.-K., Choi, S.-H., Kim, I., Jung, H. C., Joung, J., Joo, Y.-C.
Published in Philosophical magazine (Abingdon, England) (21.01.2008)
Published in Philosophical magazine (Abingdon, England) (21.01.2008)
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Journal Article
Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis
Cho, Ju-Young, Yang, Tae-Youl, Park, Yong-Jin, Lee, Yoo-Yong, Joo, Young-Chang
Published in ECS solid state letters (23.04.2014)
Published in ECS solid state letters (23.04.2014)
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Journal Article
Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board
Lee, Shin-Bok, Yoo, Young-Ran, Jung, Ja-Young, Park, Young-Bae, Kim, Young-Sik, Joo, Young-Chang
Published in Thin solid films (10.05.2006)
Published in Thin solid films (10.05.2006)
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Journal Article
Conference Proceeding
Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability
Budiman, A. S., Shin, H., Kim, B.-J, Hwang, S.-H, Son, H.-Y, Suh, M.-S, Chung, Q.-H, Byun, K.-Y, Joo, Y.-C, Caramto, R., Smith, L., Kunz, M., Tamura, N.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films
Paik, Jong-Min, Park, Young-Joon, Yoon, Min-Seung, Lee, Je-Hun, Joo, Young-Chang
Published in Scripta materialia (17.03.2003)
Published in Scripta materialia (17.03.2003)
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Journal Article
Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low- k interconnects for ULSI
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Journal Article
Conference Proceeding
Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects
Budiman, A.S., Hau-Riege, C.S., Besser, P.R., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.
Published in 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual (01.04.2007)
Published in 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual (01.04.2007)
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Conference Proceeding