Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive
Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae
Published in ETRI journal (01.12.2011)
Published in ETRI journal (01.12.2011)
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Journal Article
Characterization of polymer matrix and low melting point solder for anisotropic conductive film
Eom, Yong-Sung, Baek, Ji-Won, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min
Published in Microelectronic engineering (01.02.2008)
Published in Microelectronic engineering (01.02.2008)
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Journal Article
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder
Baek, Ji-Won, Jang, Keon-Soo, Eom, Yong-Sung, Moon, Jong-Tae, Kim, Jong-Min, Nam, Jae-Do
Published in Microelectronic engineering (01.10.2010)
Published in Microelectronic engineering (01.10.2010)
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Journal Article
Novel Bumping Material for Solder‐on‐Pad Technology
Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.08.2011)
Published in ETRI journal (01.08.2011)
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Journal Article
Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs
KIM, Sungil, EOM, Yong-Sung, LEE, Chul-Wook, BAEK, Yongsoon, MOON, Jong-Tae, KANG, Kwang-Yong, LEE, Hai-Young
Published in Journal of lightwave technology (15.03.2009)
Published in Journal of lightwave technology (15.03.2009)
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Journal Article
Novel Maskless Bumping for 3D Integration
Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.04.2010)
Published in ETRI journal (01.04.2010)
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Journal Article
Development of Packaging Technologies for High-Speed ( ≫40Gb/s) Optical Modules
Choi, K.-S., Kwon, Y.-H., Choe, J.-S., Chung, Y.-D., Kang, Y.-S., Kim, J., Ahn, B.-T., Moon, J.-T.
Published in IEEE journal of selected topics in quantum electronics (01.09.2006)
Published in IEEE journal of selected topics in quantum electronics (01.09.2006)
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Journal Article
Right‐Angle‐Bent CPW for the Application of the Driver‐Amplifier‐Integrated 40 Gbps TW‐EML Module
Yun, Ho‐Gyeong, Choi, Kwang‐Seong, Kwon, Yong‐Hwan, Choe, Joong‐Seon, Moon, Jong‐Tae, Lee, Myung‐Hyun
Published in ETRI journal (01.10.2006)
Published in ETRI journal (01.10.2006)
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Journal Article
New Impedance Matching Scheme for 60 GHz Band Electro‐Absorption Modulator Modules
Choi, Kwang‐Seong, Chung, Yong‐Duck, Kang, Young‐Shik, Jun, Dong‐Suk, Ahn, Byoung‐Tae, Moon, Jong‐Tae, Kim, Jeha
Published in ETRI journal (01.06.2006)
Published in ETRI journal (01.06.2006)
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Journal Article
Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive
Eom, Yong-Sung, Choi, Kwang-Seong, Moon, Seok-Hwan, Park, Jun-Hee, Lee, Jong-Hyun, Moon, Jong-Tae
Published in ETRI journal (01.12.2011)
Get full text
Published in ETRI journal (01.12.2011)
Journal Article
Novel Bumping Material for Solder-on-Pad Technology
Choi, Kwang-Seong, Chu, Sun-Woo, Lee, Jong-Jin, Sung, Ki-Jun, Bae, Hyun-Cheol, Lim, Byeong-Ok, Moon, Jong-Tae, Eom, Yong-Sung
Published in ETRI journal (30.08.2011)
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Published in ETRI journal (30.08.2011)
Journal Article
Novel Maskless Bumping for 3D Integration
Choi, Kwang-Seong, Sung, Ki-Jun, Lim, Byeong-Ok, Bae, Hyun-Cheol, Jung, Sung-Hae, Moon, Jong-Tae, Eom, Yong-Sung
Published in ETRI journal (30.04.2010)
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Published in ETRI journal (30.04.2010)
Journal Article
Reliability of composite solder bumps produced by an in-situ process
LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, DONG HYUK SHIN, KIM, Yong-Seog
Published in Journal of electronic materials (01.10.2000)
Published in Journal of electronic materials (01.10.2000)
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