Delamination between dielectric layers of FOPLP due to copper residue under high temperature storage conditions
Yu, Yeonseop, Ha, Job, Park, Mijin, Yang, Eunju, Kim, Miyang
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Diffusion and oxidation of copper in polymer of Fan Out-Panel Level Package (FO-PLP) under High Temperature Storage (HTS) Conditions
Yu, Yeonseop, Ha, Job, Park, Mijin, Kim, Miyang, Yang, Eunju
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Fabrication and optimization of wafer level SAW filter package using laser via drilling
Seung Wook Park, Ju Pyo Hong, Tae Hoon Kim, Si Joong Yang, Job Ha, Tae Ho Kim, Sang Wook Park, Young Do Kweon, Sung Yi
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Electrochemical Migration Failure under Biased HAST due to Photoresist Residues
Ha, Job, Yu, Yeon-Seop, Lee, Hyoung-Rok, Cho, Kang-Young
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Solder Joint Reliability of Double sided Assembled PLP Package
Ha, Job, Yu, Yeon-Seop, Cho, Kang-Young
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
MUF Technology Development for SiP Module
Kweon, YoungDo, Ha, Job, Kim, KiChan, Jang, MinSeok, Doh, JaeCheon, Lee, ChangBae, Yoo, Dojae
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Reliability evaluation of semiconductor using ultrasound
Hyoseong Jang, Job Ha, Kyungyoung Jhang, Joonhyun Lee
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
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Conference Proceeding
Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor
Jhang, Kyungyoung, Jang, Hyoseong, Park, Byungil, Ha, Job, Park, Ikkeun, Kim, Kyungsuk
Published in NDT & E international : independent nondestructive testing and evaluation (01.12.2002)
Published in NDT & E international : independent nondestructive testing and evaluation (01.12.2002)
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Journal Article
Mechanism of u-HAST failure caused by flux residue containing bromide
Yu, Yeonseop, Lee, HyoungRok, Ha, Job, Kim, Seungwan, Jeon, Jongmyeong, Cho, Kang-Young, Baek, Hong-Joo
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Wafer Level SAW RF Filter Packaging With Through Wafer Via Interconnection
Kweon, Youngdo, Park, Seungwook, Kim, Taehoon, Honh, Jupyo, Yang, Sijoong, Ha, Job, Kim, Taeho, Yi, Sung
Published in ECS transactions (06.03.2009)
Published in ECS transactions (06.03.2009)
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Journal Article
Novel substrate technology for IPM (intelligent power module) applications: Structural, thermal and electrical characteristics
Kwang-Soo Kim, Young-Ki Lee, Young-Hoon Kwak, Ji Hyun Park, Ha, Job, Ga-Young Shin, Bum-Seok Suh
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
Hong, Ju Pyo, Choi, Seog Moon, Kim, Tae Hoon, Ha, Job, Park, Seung Wook
Year of Publication 22.03.2011
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Year of Publication 22.03.2011
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