Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via
Jin, SangHoon, Kim, Sung-Min, Jo, Yugeun, Lee, Woon Young, Lee, Sang-Yul, Lee, Min Hyung
Published in Electronic materials letters (01.11.2022)
Published in Electronic materials letters (01.11.2022)
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Journal Article
Influence of Complexing Agents on Attaining Homogeneous Composition in SnAg Electroplating
Jo, Yugeun, Kim, Sung-Min, Lee, Ki-Taik, Jin, SangHoon, Lee, Woon Young, Hyung Lee, Min
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
On the role of complexing agents in co-electrodeposition of SnAg alloy with uniform composition
Jo, Yugeun, Kim, Sung-Min, Jeong, Eun-Suk, Lee, Ki-Taik, Jin, SangHoon, Lee, Woon Young, Lee, Sang-Yul, Lee, Min Hyung
Published in Materials science in semiconductor processing (01.11.2023)
Published in Materials science in semiconductor processing (01.11.2023)
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Journal Article
The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)
Jin, Sang Hoon, Yoon, Young, Jo, Yugeun, Lee, SangYul, Moon, HyungSoo, Seok, Seongho, Kim, Myung Jun, Kim, Jae Jeong, Lee, Min Hyung
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (25.04.2021)
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (25.04.2021)
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Journal Article
Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
Jo, Yugeun, Kim, Sung-Min, Jin, SangHoon, Lee, Woon Young, Lee, Sang-Yul, Lee, Min Hyung
Published in ACS omega (18.10.2022)
Published in ACS omega (18.10.2022)
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Journal Article
A Study on Void-Free Filling of a High-Aspect-Ratio Though-Silicon Via
Jin, SangHoon, Lee, Woon-Young, Lee, Dong-Ryul, Jo, Yugeun, Lee, Min-Hyung
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
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Journal Article