Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications
Zheng, Ting, Jo, Paul K., Rajan, Sreejith Kochupurackal, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2021)
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Journal Article
Polylithic Integration of 2.5-D and 3-D Chiplets Enabled by Multi-Height and Fine-Pitch CMIs
Jo, Paul K., Kochupurackal Rajan, Sreejith, Gonzalez, Joe L., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Polylithic Integration for RF/MM-Wave Chiplets using Stitch-Chips: Modeling, Fabrication, and Characterization
Zheng, Ting, Jo, Paul K., Rajan, Sreejith Kochupurackal, Bakir, Muhannad S.
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
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Conference Proceeding
3-D Integrated Electronic Microplate Platform for Low-Cost Repeatable Biosensing Applications
Muneeb Zia, Taiyun Chi, Jong Seok Park, Su, Amy, Gonzalez, Joe L., Jo, Paul K., Styczynski, Mark P., Hua Wang, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2016)
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Journal Article
Polylithic Integration of 2.5D and 3D Chiplets Using Interconnect Stitching
Jo, Paul K., Zheng, Ting, Bakir, Muhannad S.
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Multi-Die Polylithic Integration Enabled by Heterogeneous Interconnect Stitching Technology (HIST)
Jo, Paul K., Zheng, Ting, Bakir, Muhannad S.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
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Conference Proceeding
Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects
Hanju Oh, Xuchen Zhang, Jo, Paul K., May, Gary S., Bakir, Muhannad S.
Published in 2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2017)
Published in 2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2017)
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Conference Proceeding