Reduction of "dark gate" defects in replacement-metal-gate process and middle-of-line contacts for advanced planar CMOS and FinFET technology
Wen Pin Peng, Min-hwa Chi, Yang Zhang, Derderian, Garo, Wahl, Jeremy, Yue Hu, Yajiang Liu, Haiting Wang, Lemon, John, Tao Wang, Jiwang Mao, Shi You
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
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Conference Proceeding
IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder
Jiwang Mao, Bin Liu, Ming Li, Yu Wang, Dali Mao
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding
The influence of pre-heat treatment on peeling resistance of oxide film of copper alloy lead frames
Jiwang Mao, Xi Chen, Anmin Hu, Ming Li, Dali Mao
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding