Whole-tree agarwood-inducing technique: an efficient novel technique for producing high-quality agarwood in cultivated Aquilaria sinensis trees
Liu, Yangyang, Chen, Huaiqiong, Yang, Yun, Zhang, Zheng, Wei, Jianhe, Meng, Hui, Chen, Weiping, Feng, Jindong, Gan, Bingchun, Chen, Xuyu, Gao, Zhihui, Huang, Junqin, Chen, Bo, Chen, Hongjiang
Published in Molecules (Basel, Switzerland) (07.03.2013)
Published in Molecules (Basel, Switzerland) (07.03.2013)
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Journal Article
Study on Curing Kinetics and the Mechanism of Ultrasonic Curing of an Epoxy Adhesive
Liu, Zhaoyi, Wang, Hui, Chen, Yizhe, Kang, Guodong, Hua, Lin, Feng, Jindong
Published in Polymers (27.01.2022)
Published in Polymers (27.01.2022)
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Journal Article
Clinical efficacy and psychological improvement in elderly patients with knee arthritis after comprehensive traditional Chinese medicine care
Wu, Jingjing, Gong, Xueyao, Lu, Wei, Wang, Deqing, Tan, Cuilian, Liao, Juanjuan, Feng, Jindong
Published in American journal of translational research (01.01.2022)
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Published in American journal of translational research (01.01.2022)
Journal Article
Immune responses to a recombinant Rv0057-Rv1352 fusion protein of Mycobacterium tuberculosis
Yang, Yourong, Feng, Jindong, Zhang, Junxian, Zhao, Weiguo, Liu, Yu, Liang, Yan, Bai, Xuejuan, Wang, Lan, Wu, Xueqiong
Published in Annals of clinical and laboratory science (2015)
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Published in Annals of clinical and laboratory science (2015)
Journal Article
Research of Speech Biomarkers for Stress Recognition Using Linear and Nonlinear Features
Li, Na, Li, Nan, Guo, Min, Feng, Jindong
Published in 2021 7th International Conference on Computer and Communications (ICCC) (10.12.2021)
Published in 2021 7th International Conference on Computer and Communications (ICCC) (10.12.2021)
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Conference Proceeding
High Density Multi-Chip Embedded Panel-Level Packaging Integration Technology
Chen, Xianming, Huang, Benxia, Hong, Yejie, Feng, Lei, Feng, Jindong, Zhu, Guilin, Huang, Gao, Dong, Yanlin, Chen, Wu
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
FENG, LEI, HUANG, BENXIA, FENG, JINDONG, WANG, WENSHI, CHEN, XIANMING
Year of Publication 14.03.2024
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Year of Publication 14.03.2024
Patent
Embedded chip package and manufacturing method thereof
Wang, Wenshi, Chen, Xianming, Huang, Benxia, Feng, Jindong, Feng, Lei
Year of Publication 26.12.2023
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Year of Publication 26.12.2023
Patent
CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
FENG, Jindong, HUANG, Gao, CHEN, Xianming, HUANG, Benxia, HUANG, Juchen
Year of Publication 07.09.2023
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Year of Publication 07.09.2023
Patent
Indoor Following Model Based on TDOA Positioning and Q-Learning Algorithm
Shu, RenBin, Feng, JinDong, Xu, YangKai, Shu, TengFeng, Shu, ZiHuan
Published in 2023 2nd International Conference on Automation, Robotics and Computer Engineering (ICARCE) (14.12.2023)
Published in 2023 2nd International Conference on Automation, Robotics and Computer Engineering (ICARCE) (14.12.2023)
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Conference Proceeding
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
FENG, Lei, FENG, Jindong, CHEN, Xianming, HUANG, Benxia, WANG, Wenshi
Year of Publication 11.05.2023
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Year of Publication 11.05.2023
Patent