Flexible electronics substrate with excellent tear-resistant and high toughness using multi-material 3D printing
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All-solution-processed PIN architecture for ultra-sensitive and ultra-flexible organic thin film photodetectors
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Li, Peng (朋李), Yuan, You-Jin (有进 原), Mao, Li-Jun (立军 冒), Yang, Jian-Cheng (建成 杨), Li, Guo-Hong (国宏 李), Yin, Da-Yu (达钰 殷), Li, Jie (杰李), Li, Xiao-Ni (小妮 李), Chai, Wei-Ping (伟平 柴), Shi, Jian (健石)
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Published in Chinese physics C (01.02.2011)
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