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"Jin, Hwail"
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"Jin, Hwail"
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Method of fabricating a semiconductor device using gas blowing agent
by
PARK CHEONIL
,
JIN HWAIL
,
EUM MYOUNGCHUL
Year of Publication
10.03.2023
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
by
PARK SANG SICK
,
JIN HWAIL
,
HONG JONGPA
Year of Publication
27.12.2022
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Semiconductor packages
by
KO JI HAN
,
JIN HWAIL
Year of Publication
12.04.2023
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Semiconductor package
by
LEE SEON HO
,
JIN HWAIL
,
HONG JONGPA
Year of Publication
11.05.2022
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Processing tape and method of manufacturing semiconductor device using the same
by
LEE SEON HO
,
JIN HWAIL
,
KIM YEONGSEOK
Year of Publication
24.01.2022
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method for bonding flip chip
by
KIM WONKEUN
,
KANG MYUNG SUNG
,
JIN HWAIL
,
CHOI YONGWON
,
KIM YEONGSEOK
Year of Publication
28.02.2020
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Semiconductor package and method of fabricating the same
by
Jin
,
Hwail
,
Park, Sang-Sick
,
Hong, Jongpa
Year of Publication
27.08.2024
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Processing tape and method of fabricating a semiconductor device using the same
by
Kim, Yeongseok
,
Jin
,
Hwail
,
Lee, Seon Ho
Year of Publication
16.07.2024
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Semiconductor package with curing layer between semiconductor chips
by
Jin
,
Hwail
,
Lee, Seon Ho
,
Hong, Jongpa
Year of Publication
12.12.2023
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ADHESIVE COMPOSITION AND WAFER PROCESSING TAPE INCLUDING THE SAME
by
JIN
,
HWAIL
,
EUM, MYOUNGCHUL
,
PARK, CHEONIL
Year of Publication
06.07.2023
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SEMICONDUCTOR PACKAGE
by
KO, Ji-Han
,
JIN
,
Hwail
Year of Publication
06.04.2023
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT
by
JIN
,
HWAIL
,
PARK, Cheonil
,
EUM, MYOUNGCHUL
Year of Publication
23.03.2023
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PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
by
JIN
,
HWAIL
,
LEE, SEON HO
,
KIM, YEONGSEOK
Year of Publication
19.09.2024
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
by
PARK, Sang-Sick
,
HONG, Jongpa
,
JIN
,
Hwail
Year of Publication
22.12.2022
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SEMICONDUCTOR PACKAGE
by
LEE, Seon Ho
,
JIN
,
Hwail
,
HONG, Jongpa
Year of Publication
05.05.2022
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SEMICONDUCTOR PACKAGE
by
LEE, Seon Ho
,
JIN
,
Hwail
,
HONG, Jongpa
Year of Publication
04.05.2022
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PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
by
JIN
,
HWAIL
,
LEE, SEON HO
,
KIM, YEONGSEOK
Year of Publication
20.01.2022
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Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same
by
JIN HWAIL
Year of Publication
04.11.2010
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DICING DIE BONDING FILM
by
JIN HWAIL
Year of Publication
02.09.2010
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KLEBEFILM FÜR CHIPBONDIERUNG
by
HWAIL
,
JIN
Year of Publication
15.08.2010
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