Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
Placette, Mark D., Fan, Xuejun, Zhao, Jie-Hua, Edwards, Darvin
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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Journal Article
Comprehensive landscape of the IPAF inflammasomes in pan-cancer: A bulk omics research and single-cell sequencing validation
Dong, Chen-cheng, Zhang, Qiu-huan, Zhang, Yan, Zhang, Yujie, Ruan, Hanyi, Qin, Tianyu, Zhao, Jie-hua, Wu, Guo, Zhu, Zhou, Yang, Jian-rong
Published in Computers in biology and medicine (01.03.2023)
Published in Computers in biology and medicine (01.03.2023)
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Journal Article
Characterization of the Viscoelasticity of Molding Compounds in the Time Domain
Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.
Published in Journal of electronic materials (01.04.2010)
Published in Journal of electronic materials (01.04.2010)
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Journal Article
Mechanical integrity evaluation of low-k device with bump shear
PENG SU, ZHAO, Jie-Hua, POZDER, Scott, WONTOR, David
Published in Journal of electronic materials (01.05.2006)
Published in Journal of electronic materials (01.05.2006)
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Journal Article
Microstructure-Based Stress Modeling of Tin Whisker Growth
Jie-Hua Zhao, Peng Su, Min Ding, Chopin, S., Ho, P.S.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
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Journal Article
Neutral and negative donors in quantum dots
Zhu, Jia-Lin, Zhao, Jie-Hua, Xiong, Jia-Jiong
Published in Journal of physics. Condensed matter (04.07.1994)
Published in Journal of physics. Condensed matter (04.07.1994)
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Journal Article
Low dielectric constant materials for advanced interconnects
Morgen, Michael, Zhao, Jie-Hua, Hu, Chuan, Cho, Taiheui, Ho, Paul S., Todd, E.
Published in JOM (1989) (01.09.1999)
Published in JOM (1989) (01.09.1999)
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Journal Article
Reliability issues for flip-chip packages
Ho, Paul S., Wang, Guotao, Ding, Min, Zhao, Jie-Hua, Dai, Xiang
Published in Microelectronics and reliability (01.05.2004)
Published in Microelectronics and reliability (01.05.2004)
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Journal Article
LOW DIELECTRIC CONSTANT MATERIALS FOR ULSI INTERCONNECTS
Morgen, Michael, Ryan, E. Todd, Zhao, Jie-Hua, Hu, Chuan, Cho, Taiheui, Ho, Paul S
Published in Annual review of materials science (01.08.2000)
Published in Annual review of materials science (01.08.2000)
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Journal Article
Experimental evaluations of the strength of silicon die by 3-point-bend versus Ball-on-Ring tests
Jie-Hua Zhao, Tellkamp, J., Gupta, V., Edwards, D.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding