Application of Principal Component Analysis in Weighted Stacking of Seismic Data
Xie, Jianyong, Chen, Wei, Zhang, Dong, Zu, Shaohuan, Chen, Yangkang
Published in IEEE geoscience and remote sensing letters (01.08.2017)
Published in IEEE geoscience and remote sensing letters (01.08.2017)
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Journal Article
Spike-Like Blending Noise Attenuation Using Structural Low-Rank Decomposition
Zhou, Yatong, Shi, Chaojun, Chen, Hanming, Xie, Jianyong, Wu, Guoning, Chen, Yangkang
Published in IEEE geoscience and remote sensing letters (01.09.2017)
Published in IEEE geoscience and remote sensing letters (01.09.2017)
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Journal Article
Designing and Modeling for Power Integrity
Swaminathan, Madhavan, Daehyun Chung, Grivet-Talocia, Stefano, Bharath, Krishna, Laddha, Vishal, Jianyong Xie
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
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Journal Article
3D transient thermal solver using non-conformal domain decomposition approach
Xie, Jianyong, Swaminathan, Madhavan
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
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Conference Proceeding
Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
Biancun Xie, Swaminathan, M., Ki Jin Han, Jianyong Xie
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
Quantitative Evaluation of Shale Brittleness Based on Brittle-Sensitive Index and Energy Evolution-Based Fuzzy Analytic Hierarchy Process
Xie, Jianyong, Zhang, Junjie, Fang, Yanping, Cao, Junxing, Deng, Jixin
Published in Rock mechanics and rock engineering (01.04.2023)
Published in Rock mechanics and rock engineering (01.04.2023)
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Journal Article
Optimization of 3D stack for electrical and thermal integrity
Bazaz, Rishik, Jianyong Xie, Swaminathan, Madhavan
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Fast electrical-thermal co-simulation using multigrid method for 3D integration
Jianyong Xie, Swaminathan, M.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Simulation of power delivery networks with Joule heating effects for 3D integration
Jianyong Xie, Swaminathan, M
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer
Biancun Xie, Swaminathan, Madhavan, Ki Jin Han, Jianyong Xie
Published in 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) (01.05.2014)
Published in 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) (01.05.2014)
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Conference Proceeding
DC IR drop solver for large scale 3D power delivery networks
Jianyong Xie, Swaminathan, M
Published in 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems (01.10.2010)
Published in 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems (01.10.2010)
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Conference Proceeding