Study of Package-on-Package solder joints under random vibration load based on Patran
Long Zhang, Chun-yue Huang, Wei Huang, Tian-ming Li, Jianwei Hua
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Get full text
Conference Proceeding
Development of the Coordinated Regional Health Development Assessment System
SHI Xiaoxiao, SHI Jianwei, JIN Hua, ZHANG Qianqian, YU Dehua
Published in Zhongguo quanke yixue (01.09.2023)
Published in Zhongguo quanke yixue (01.09.2023)
Get full text
Journal Article
Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition
Hua, Jianwei, Huang, Chunyue, Liang, Ying, Li, Tian-ming, Zhang, Long
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Get full text
Conference Proceeding