Comparative transcriptome analysis and HPLC reveal candidate genes associated with synthesis of bioactive constituents in Rheum palmatum complex
Yang, Li, Sun, Jiangyan, Zhang, Tianyi, Chu, Dake, Zhou, Tao, Wang, Xumei
Published in Physiology and molecular biology of plants (01.08.2024)
Published in Physiology and molecular biology of plants (01.08.2024)
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Journal Article
Tourism Competitiveness Evaluation: Evidence From Mountain Tourism in China
Cao, Qian, Sarker, Md Nazirul Islam, Zhang, Dian, Sun, Jiangyan, Xiong, Teng, Ding, Jieying
Published in Frontiers in psychology (31.03.2022)
Published in Frontiers in psychology (31.03.2022)
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Journal Article
Peimine promotes microglial polarization to the M2 phenotype to attenuate drug-resistant epilepsy through suppressing the TLR4/NF-κB/HIF-1α signaling pathway in a rat model and in BV-2 microglia
Liu, Chongchong, Sun, Jiangyan, Shen, Xiaoming, Li, Shefang, Luo, Sha, Chen, Na, Zhang, Yunke
Published in Heliyon (15.08.2024)
Published in Heliyon (15.08.2024)
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Journal Article
Exploring the Construction Path of Characteristic Volunteer Service Teams in “Double First-Class” Universities under the Volunteer Service Framework
Li, Xianying, Zhang, Yunkai, Sun, Jiangyan, Li, Kexin, Zhao, Yunhan, Ding, Hao
Published in SHS web of conferences (2024)
Published in SHS web of conferences (2024)
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Journal Article
Comparative Transcriptome Analyses of Different Rheum officinale Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis
Zhou, Lipan, Sun, Jiangyan, Zhang, Tianyi, Tang, Yadi, Liu, Jie, Gao, Chenxi, Zhai, Yunyan, Guo, Yanbing, Feng, Li, Zhang, Xinxin, Zhou, Tao, Wang, Xumei
Published in Genes (05.09.2022)
Published in Genes (05.09.2022)
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Journal Article
Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer
Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
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Journal Article
Transcriptome profiles of yellowish-white and fuchsia colored flowers in the Rheum palmatum complex reveal genes related to color polymorphism
Zhou, Tao, Sun, Jiangyan, Zhai, Yunyan, Gao, Chenxi, Ruhsam, Markus, Wang, Xumei
Published in Plant molecular biology (01.09.2022)
Published in Plant molecular biology (01.09.2022)
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Journal Article
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Comparative Transcriptome Analyses of Different IRheum officinale/I Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis
Zhou, Lipan, Sun, Jiangyan, Zhang, Tianyi, Tang, Yadi, Liu, Jie, Gao, Chenxi, Zhai, Yunyan, Guo, Yanbing, Feng, Li, Zhang, Xinxin, Zhou, Tao, Wang, Xumei
Published in Genes (01.09.2022)
Published in Genes (01.09.2022)
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Journal Article
Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution
Chao Li, Anmin Hu, Ming Li, Jiangyan Sun
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Effect of different pretreatments on through silicon via copper filling
Yi Li, Haiyong Cao, Xue Feng, Huiqin Ling, Ming Li, Jiangyan Sun
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Pure Bottom-up filling process for efficient TSV metallization
Li Ma, Huiqin Ling, Ming Li, Jiangyan Sun, Xianxian Yu, Yanyan Li
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Investigation of competitive adsorption between accelerator and suppressor in TSV copper electroplating
Yue Lu, Haiyong Cao, Qi Sun, Huiqin Ling, Ming Li, Jiangyan Sun
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
The study on the shaping of electroplated copper pillar bumping
Ying Han, Ming Li, Hongqi Sun, Jiangyan Sun
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding