Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Jianbiao Pan, Silk, J., Powers, M., Hyland, P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)
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Journal Article
Finding and optimising the key factors for the multiple-response manufacturing process
Pan, Jeh-Nan, Pan, Jianbiao, Lee, Chun-Yi
Published in International journal of production research (01.01.2009)
Published in International journal of production research (01.01.2009)
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Journal Article
The effect of reflow profile on SnPb and SnAgCu solder joint shear strength
Pan, Jianbiao, Toleno, Brian J, Chou, Tzu-Chien, Dee, Wesley J
Published in Soldering & surface mount technology (01.10.2006)
Published in Soldering & surface mount technology (01.10.2006)
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Journal Article
Drop impact reliability of edge-bonded lead-free chip scale packages
Farris, Andrew, Pan, Jianbiao, Liddicoat, Albert, Krist, Michael, Vickers, Nicholas, Toleno, Brian J., Maslyk, Dan, Shangguan, Dongkai, Bath, Jasbir, Willie, Dennis, Geiger, David A.
Published in Microelectronics and reliability (01.07.2009)
Published in Microelectronics and reliability (01.07.2009)
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Journal Article
The Effect of Solder Joint Microstructure on the Drop Test Failure-A Peridynamic Analysis
Mehrmashhadi, Javad, Tang, Yuye, Zhao, Xiaoliang, Xu, Zhanping, Pan, Jianbiao John, Le, Quang Van, Bobaru, Florin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
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Journal Article
Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste
Jianbiao Pan
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
Powers, Mike, Pan, Jianbiao, Silk, Julie, Hyland, Patrick
Published in Journal of electronic materials (01.02.2012)
Published in Journal of electronic materials (01.02.2012)
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Journal Article
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies
POWERS, Mike, PAN, Jianbiao, SILK, Julie, HYLAND, Patrick
Published in Journal of electronic materials (2012)
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Published in Journal of electronic materials (2012)
Journal Article
Drop test reliability of lead-free chip scale packages
farris, A., Jianbiao Pan, Liddicoat, A., Toleno, B.J., Maslyk, D., Dongkai Shangguan, Bath, J., Willie, D., Geiger, D.A.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
A Comparative Study of Various Loss Functions in the Economic Tolerance Design
Jeh-Nan Pan, Jianbiao Pan
Published in 2006 IEEE International Conference on Management of Innovation and Technology (01.06.2006)
Published in 2006 IEEE International Conference on Management of Innovation and Technology (01.06.2006)
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Conference Proceeding
Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP
Jianbiao Pan, Tonkay, G.L., Storer, R.H., Sallade, R.M., Leandri, D.J.
Published in Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999)
Published in Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999)
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Conference Proceeding
Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability
Jianbiao Pan, Pafchek, R.M., Judd, F.F., Baxter, J.
Published in IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) (2004)
Published in IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) (2004)
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Conference Proceeding