Search Results - "Jhih-Yu Wang" :: K.UTB vyhledávací portál

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Development of 3D carbon nanotube interdigitated finger electrodes on polymer substrate for flexible capacitive sensor application

by Hu, Chih-Fan, Wang, Jhih-Yu, Liu, Yu-Chia, Tsai, Ming-Han, Fang, Weileun
Published in Nanotechnology (08.11.2013)

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Journal Article

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A Power-Scalable Three-Dimensional Streaming Playback Mechanism on Heterogeneous System Architectures

by Wang, Ming-Shi, Chen, Shih-Yeh, Wang, Yu-Jhih
Published in IEEE systems journal (01.03.2017)

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Journal Article

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Smart System for the Identification of Fruit Quality and Prototype Implementation of an Honest Store

by Wang, Jhih-Yu, Tsai, Ya-Rung, Tsai, Ming-Fong
Published in 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) (17.07.2023)

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Conference Proceeding

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Wavelength-selective optomechanical sensor based on interpenetrating polymer network

by Cheng-Hsi Weng, Yu-Jhih Wang, Pei-Zen Chang, Chi-An Dai, Wen-Pin Shih
Published in 2012 IEEE Sensors (01.10.2012)

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Conference Proceeding

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Development of 3D CNTS interdigitated finger electrodes on flexible polymer for bending strain measurement

by Jhih-Yu Wang, Chih-Fan Hu, Chitsung Hong, Wang-Shen Su, Weileun Fang
Published in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (01.01.2011)

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Conference Proceeding

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Development of 3D carbon nanotube interdigitated finger electrodes on polymer substrate for flexible capacitive sensor application: Sensing at the nanoscale

by HU, Chih-Fan, WANG, Jhih-Yu, LIU, Yu-Chia, TSAI, Ming-Han, WEILEUN FANG
Published in Nanotechnology (2013)

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Journal Article

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INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 06.06.2024

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Patent

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METHOD OF FORMING SEMICONDUCTOR DEVICE

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 14.03.2024

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Patent

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Integrated fan-out package and manufacturing method thereof

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 06.02.2024

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Patent

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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 01.02.2024

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Patent

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Method of forming semiconductor device

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 26.12.2023

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Patent

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Semiconductor package and manufacturing method thereof

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 24.10.2023

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Patent

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PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 14.09.2023

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Patent

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Package structure and method of fabricating the same

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 04.07.2023

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Patent

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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 07.07.2022

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Patent

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Method of Forming Semiconductor Device

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 30.06.2022

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Patent

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Semiconductor package and manufacturing method thereof

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 29.03.2022

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Patent

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Method of forming semiconductor device

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 15.03.2022

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Patent

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INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 23.12.2021

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Patent

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Integrated fan-out package and manufacturing method thereof

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chu, Yung-Chi, Wang, Jhih-Yu
Year of Publication 07.09.2021

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Patent

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