7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate
JungChak Ahn, Kyungho Lee, Yitae Kim, Heegeun Jeong, Bumsuk Kim, Hongki Kim, Jongeun Park, Taesub Jung, Wonje Park, Taeheon Lee, Eunkyung Park, Sangjun Choi, Gyehun Choi, Haeyong Park, Yujung Choi, Seungwook Lee, Yunkyung Kim, Jung, Y. Jay, Donghyuk Park, Seungjoo Nah, Youngsun Oh, Mihye Kim, Yooseung Lee, Youngwoo Chung, Hisanori, Ihara, Joonhyuk Im, Lee, Daniel K. J., Byunghyun Yim, GiDoo Lee, Heesang Kown, Sungho Choi, Jeonsook Lee, Dongyoung Jang, Youngchan Kim, Tae Chan Kim, Hiroshige, Goto, Chi-Young Choi, Duckhyung Lee, GabSoo Han
Published in 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) (01.02.2014)
Published in 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) (01.02.2014)
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