Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging
Yoo, Young-Ran, Kim, Gyubinn, Jeon, Sung-Min, Park, Hyun-Jun, Seo, Won-Wook, Moon, Jeong-Tak, Kim, Young-Sik
Published in Materials (22.11.2023)
Published in Materials (22.11.2023)
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Journal Article
Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds
McCracken, Michael James, Koda, Yusuke, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
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Journal Article
Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire
Son, Seoung-Bum, Roh, Hyunchul, Kang, Suk Hoon, Chung, Hee-Suk, Kim, Do Hyun, Choi, Yong Seok, Cho, Jong Soo, Moon, Jeong-Tak, Oh, Kyu Hwan
Published in Gold Bulletin (01.12.2011)
Published in Gold Bulletin (01.12.2011)
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Journal Article
반도체 패키징용 금-코팅된 은 와이어의 부식특성
홍원식, Won Sik Hong, 김미송, Mi-song Kim, 김상엽, Sang Yeop Kim, 전성민, Sung Min Jeon, 문정탁, Jeong Tak Moon, 김영식, Youngsik Kim
Published in Corrosion science and technology (31.10.2021)
Published in Corrosion science and technology (31.10.2021)
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Journal Article
A numerical approach on the inclusion effects in ultrafine gold wire drawing process
Son, Seoung-Bum, Lee, Young Kwang, Kang, Suk Hoon, Chung, Hee-Suk, Cho, Jong Soo, Moon, Jeong-Tak, Oh, Kyu Hwan
Published in Engineering failure analysis (01.07.2011)
Published in Engineering failure analysis (01.07.2011)
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Journal Article
Breakup behavior of a molten metal jet
Oh, Yong Suk, Choi, Dong Yun, Son, Jae Yeol, Kim, Bo Young, Kang, Hyun Wook, Chang, Cheong Bong, Moon, Jeong-Tak, Sung, Hyung Jin
Published in The International journal of heat and fluid flow (01.12.2014)
Published in The International journal of heat and fluid flow (01.12.2014)
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Journal Article
Symmetric miniaturized heating system for active microelectronic devices
McCracken, Michael, Mayer, Michael, Jourard, Isaac, Moon, Jeong-Tak, Persic, John
Published in Review of scientific instruments (01.07.2010)
Published in Review of scientific instruments (01.07.2010)
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Journal Article
반도체 패키징용 금 코팅된 은 와이어의 초음파 접합부 열화 특성
김미송(Mi-Song Kim), 홍원식(Won Sik Hong), 김상엽(Sang Yeop Kim), 전성민(Sung Min Jeon), 문정탁(Jeong Tak Moon)
Published in 대한용접·접합학회지 (2021)
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Published in 대한용접·접합학회지 (2021)
Journal Article
Reliability study of low cost alternative Ag bonding wire with various bond pad materials
Kyung-Ah Yoo, Chul Uhm, Tae-Jin Kwon, Jong-Soo Cho, Jeong-Tak Moon
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Sn-3.0wt.%Ag-0.5wt.%Cu솔더볼접합부의고속전단특성
이영곤, Young Gon Lee, 이희열, Hee Yul Lee, 문정탁, Jeong Tak Moon, 박재현, Jai Hyun Park, 한신식, Shin Sik Han, 정재필, Jae Pil Jung
Published in 대한금속재료학회지 (22.09.2009)
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Published in 대한금속재료학회지 (22.09.2009)
Journal Article
Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability
Yong-Sung Park, Yong-Min Kwon, Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, Kyung-Wook Paik
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Investigation of interfacial phenomena of alloyed Au wire bonding
Hyoung Joon Kim, Min-Seok Song, Kyung-Wook Paik, Jeong-Tak Moon, Jun-Yeob Song
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Assessing Au-Al wire bond reliability using integrated stress sensors
McCracken, Michael J, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Pd effects on the reliability in the low cost Ag bonding wire
Jong-Soo Cho, Kyeong-Ah Yoo, Sung-Jae Hong, Jeong-Tak Moon, Yong-Je Lee, Wongil Han, Hanki Park, Seung-Weon Ha, Seong-Bum Son, Suk-Hoon Kang, Kyu-Hwan Oh
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging
Yong-Sung Park, Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, Kyung-Wook Paik
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization
Jong-Soo Cho, Hee-Suk Jeong, Jeong-Tak Moon, Se-Jin Yoo, Jae-Seok Seo, Seung-Mi Lee, Seung-Weon Ha, Eun-Kyu Her, Suk-Hoon Kang, Kyu-Hwan Oh
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding