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Year of Publication 30.07.2024
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INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS
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Year of Publication 11.05.2023
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INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS
JAN, Chia-Hong, BASU, Debashish, BAI, Peng, O'BRIEN, Daniel B, AN, Seungdo, JEONG, James Y, LEIB, Jeffrey S, PLEKHANOV, Pavel S
Year of Publication 10.05.2023
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Year of Publication 10.05.2023
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ENHANCED GRATING ALIGNED PATTERNING FOR EUV DIRECT PRINT PROCESSES
KADALI, Shyam Benegal, M BARGHI, Seyedhamed, FANG, Sheng-Po, WALLACE, Charles H, PAIK, Marvin Y, GULER, Leonard P, JEONG, James Y
Year of Publication 02.06.2022
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Year of Publication 02.06.2022
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ENHANCED GRATING ALIGNED PATTERNING FOR EUV DIRECT PRINT PROCESSES
KADALI, Shyam Benegal, M BARGHI, Seyedhamed, FANG, Sheng-Po, WALLACE, Charles H, PAIK, Marvin Y, GULER, Leonard P, JEONG, James Y
Year of Publication 02.06.2022
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Year of Publication 02.06.2022
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Zwischenverbindungsstruktur umfassend Metall-Rückseiten-Umverteilungsleitungen mit sehr kleinem Teilungsabstand kombiniert mit Durchkontaktierungen
Lee, Kevin J, Puri, Puneesh, Kang, Jiho, Jeong, James Y, Telang, Adwait, Muirhead, John, Chang, Hsiao-Kang, Patel, Nitin M
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
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