Electronic package and manufacturing method of Electronic package
MIN KYUNG DEUK, KANG DONG GIL, HA EUN, KIM JANG BAEG, JUNG SEUNG BOO, KIM KYUNG YEOL, NOH TAE JOON, JEONG HAK SAN
Year of Publication 02.07.2024
Get full text
Year of Publication 02.07.2024
Patent
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
HA, Eun, KANG, Dong Gil, JUNG, Seung Boo, KIM, Jang Baeg, KIM, Kyung Yeol, NOH, Tae Joon, MIN, Kyung Deuk, JEONG, Hak San
Year of Publication 27.06.2024
Get full text
Year of Publication 27.06.2024
Patent
Method for Manufacturing Semiconductor devices
MIN KYUNG DEUK, LEE HYE KYOUNG, KANG TAE GYU, KANG DONG GIL, HA EUN, JUNG SEUNG BOO, OH NAM YONG, HWANG JAE SEON, JEONG HAK SAN
Year of Publication 05.04.2023
Get full text
Year of Publication 05.04.2023
Patent
Method for adhesive bonding dissimilar materials using intense pulsed light surface treatment
HWANG BYEONG UK, MIN KYUNG DEUK, LEE CHOONG JAE, KANG DONG GIL, JUNG SEUNG BOO, JEONG HAK SAN, KIM JAE HA
Year of Publication 22.02.2022
Get full text
Year of Publication 22.02.2022
Patent
Method for hybrid transient liquid phase sintering bonding for dissimilar material bonding
JUNG KWANG HO, MIN KYUNG DEUK, LEE CHOONG JAE, JUNG SEUNG BOO, JEONG HAK SAN, PARK BUM GEUN
Year of Publication 26.08.2020
Get full text
Year of Publication 26.08.2020
Patent
Bonding method and apparatus of soldering assisted by magnetic field
JUNG KWANG HO, HWANG BYEONG UK, MIN KYUNG DEUK, LEE CHOONG JAE, JUNG SEUNG BOO, JEONG HAK SAN, KIM JAE HA
Year of Publication 26.07.2021
Get full text
Year of Publication 26.07.2021
Patent
METHOD OF TRANSIENT LIQUID PHASE BONDING FOR METAL MATERIAL BONDING USING MAGNETIC FORCE
JUNG KWANG HO, HWANG BYEONG UK, MIN KYUNG DEUK, LEE CHOONG JAE, JUNG SEUNG BOO, JEONG HAK SAN, KIM JAE HA
Year of Publication 07.07.2020
Get full text
Year of Publication 07.07.2020
Patent
METHOD OF FORMING REDISTRIBUTION LAYER USING PHOTOSINTERING
JUNG KWANG HO, MIN KYUNG DEUK, LEE CHOONG JAE, JUNG SEUNG BOO, MYUNG WOO RAM, JEONG HAK SAN, PARK BUM GEUN
Year of Publication 04.11.2019
Get full text
Year of Publication 04.11.2019
Patent
Method for transient liquid-phase bonding between metal materials using a magnetic force
Jeong, Hak San, Min, Kyung Deuk, Hwang, Byeong Uk, Lee, Choong Jae, Jung, Kwang Ho, Kim, Jae Ha, Jung, Seung Boo
Year of Publication 17.08.2021
Get full text
Year of Publication 17.08.2021
Patent
METHOD FOR TRANSIENT LIQUID-PHASE BONDING BETWEEN METAL MATERIALS USING A MAGNETIC FORCE
JUNG, Seung Boo, JUNG, Kwang Ho, KIM, Jae Ha, HWANG, Byeong Uk, MIN, Kyung Deuk, JEONG, Hak San, LEE, Choong Jae
Year of Publication 03.12.2020
Get full text
Year of Publication 03.12.2020
Patent