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Published in PloS one (29.03.2017)
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A cross-sectional study of surgical glove perforation during the posterior lumbar interbody spinal fusion surgery: Its frequency, location, and risk factors
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Published in Medicine (Baltimore) (01.06.2018)
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A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology
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Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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