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Conductive polymer particles with metal coating layer and conductive adhesive including the conductive polymer particles
by
JUNG WON CHIN
,
CHO SANG HO
,
JEON KANG ROK
,
SONG JI MIN
,
UM SANG YONG
Year of Publication
02.09.2024
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Transient Liquid-Phase Sinter-Bonding Characteristics of a 5 um Cu@Sn Particle-Based Preform for High-Speed Die Bonding of Power Devices
by
Han, Byeong Jo
,
Cho, Sang Ho
,
Jeon
,
Kang Rok
,
Lee, Jong-Hyun
Published in
Korean Journal of Metals and Materials
(05.01.2024)
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