Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method
Jeon, Eun-Beom, Park, Sung-Hyeon, Yoo, Yun-Sik, Kim, Hak-Sung
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2016)
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Journal Article
Identification of stiffness distribution of fatigue loaded polymer concrete through vibration measurements
Ahn, Sangkeun, Jeon, Eun-Beom, Koh, Hyo-In, Kim, Hak-Sung, Park, Junhong
Published in Composite structures (01.02.2016)
Published in Composite structures (01.02.2016)
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Journal Article
Dependence of polymer concrete vibration characteristics on internal pipe and damper embedment
Ahn, Sangkeun, Jeon, Eun-Beom, Yang, Wonseok, Koh, Hyo-In, Kim, Hak-Sung, Park, Junhong
Published in Composite structures (20.05.2016)
Published in Composite structures (20.05.2016)
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Journal Article
An investigation of contact resistance between carbon fiber/epoxy composite laminate and printed silver electrode for damage monitoring
Jeon, Eun-Beom, Fujimura, Takahiro, Takahashi, Kosuke, Kim, Hak-Sung
Published in Composites. Part A, Applied science and manufacturing (01.11.2014)
Published in Composites. Part A, Applied science and manufacturing (01.11.2014)
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Journal Article
Ultra-fast annealing to reduce the residual stress in ultra-thin chips using flash light
Jeon, Eun-Beom, Park, Junhong, Kim, Hak-Sung
Published in Journal of micromechanics and microengineering (01.04.2014)
Published in Journal of micromechanics and microengineering (01.04.2014)
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Journal Article
Bi-axial fracture strength characteristic of an ultra-thin flash memory chip
Jeon, Eun-Beom, Park, Jae-Dong, Song, Jung Han, Lee, Hye Jin, Kim, Hak-Sung
Published in Journal of micromechanics and microengineering (01.10.2012)
Published in Journal of micromechanics and microengineering (01.10.2012)
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Journal Article
Instant electrode fabrication on carbon-fiber-reinforced plastic structures using metal nano-ink via flash light sintering for smart sensing
Takahashi, Kosuke, Namiki, Kensuke, Fujimura, Takahiro, Jeon, Eun-Beom, Kim, Hak-Sung
Published in Composites. Part B, Engineering (01.07.2015)
Published in Composites. Part B, Engineering (01.07.2015)
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Journal Article
AN APPARATUS AND METHOD TO REDUCE THE RESIDUAL STRESS OF SEMICONDUCTOR
LEE, JEONG SAM, JIN, HO TAE, JEON, EUN BEOM, PARK, JAE DONG, KIM, HAK SUNG
Year of Publication 21.07.2014
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Year of Publication 21.07.2014
Patent
APPARATUS AND METHOD FOR REDUCING RESIDUAL STRESS OF SEMICONDUCTOR
KIM HAK SUNG, JIN HO-TAE, PARK JAE DONG, JEON EUN BEOM, LEE JEONG SAM
Year of Publication 10.07.2014
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Year of Publication 10.07.2014
Patent