Search Results - "Jeng, Shin-Pu" :: K.UTB vyhledávací portál

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HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT IN MOLDING STRUCTURE AND METHODS FOR FORMING THE SAME

by Jeng, Shin-Pu, Liu, Monsen, LAI, Po-Ying, Tsai, Shang-Lun, Chen, Shuo-Mao
Year of Publication 04.05.2023

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Al-Cu covered connect structure of integrated circuit and method for producing the same

by JENG, SHIN-PU, HOU, SHANG-YUNG
Year of Publication 11.11.2003

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Structure of metal fuse of semiconductor device

by JENG, SHIN-PU, WU, JI-SHI, HOU, SHANG-YUNG
Year of Publication 21.04.2003

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Method for forming bottom anti-reflective coating (BARC)

by CHEN CHUNSHING, LINLIU KUNG, KUO MAI-RU, JENG SHIN-PU
Year of Publication 09.10.2001

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Method for forming a crown capacitor

by LUO, JI-JIN, JENG, SHIN-PU, LU, YIIAN
Year of Publication 21.01.2001

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Method for forming bottom reflection layer

by JENG, SHIN-PU, GUO, MEI-RU, LIN, LIOU-GUNG
Year of Publication 01.12.2000

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Method of forming bottom anti-reflective coating on substrate

by JENG, SHIN-PU, GUO, MEI-RU, CHEN, CHUEN-SHING, LIN, LIOU-GUNG
Year of Publication 11.11.2000

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Patent

HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT IN MOLDING STRUCTURE AND METHODS FOR FORMING THE SAME

Al-Cu covered connect structure of integrated circuit and method for producing the same

Structure of metal fuse of semiconductor device

Method for forming bottom anti-reflective coating (BARC)

Method for forming a crown capacitor

Method for forming bottom reflection layer

Method of forming bottom anti-reflective coating on substrate

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