Search Results - "Jen, Wei-Lun Kane" :: K.UTB vyhledávací portál

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by ROY MIHIR K, LOTZ STEPHANIE M, JEN WEI LUN KANE
Year of Publication 08.03.2016

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by ROY MIHIR K, LOTZ STEPHANIE M, JEN WEI LUN KANE
Year of Publication 30.06.2014

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MULTILAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING

by JEN WEI LUN KANE, SENEVIRATNE DILAN, CHEN CHI MON, JAIN PADAM
Year of Publication 27.07.2016

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ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER

by AGRAHARAM SAIRAM, JEN WEI LUN KANE, SWAMINATHAN RAJASEKARAN, ALUR AMRUTHAVALLI PALLAVI, VISWANATH RAM
Year of Publication 19.02.2016

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by ROY, Mihir K, LOTZ, Stefanie M, JEN, Wei-Lun Kane
Year of Publication 02.10.2024

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 26.09.2024

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High density organic bridge device and method

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 04.06.2024

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DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by SALAMA, Islam A, JEN, Wei-Lun Kane, MAY, Robert Alan, DARMAWIKARTA, Kristof, ROSCH, Jonathan L
Year of Publication 01.08.2024

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Device and method of very high density routing used with embedded multi-die interconnect bridge

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 16.07.2024

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Device and method of very high density routing used with embedded multi-die interconnect bridge

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 18.06.2024

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DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by SALAMA, Islam A, JEN, Wei-Lun Kane, MAY, Robert Alan, DARMAWIKARTA, Kristof, ROSCH, Jonathan L
Year of Publication 04.05.2023

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DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by SALAMA, Islam A, JEN, Wei-Lun Kane, MAY, Robert Alan, DARMAWIKARTA, Kristof, ROSCH, Jonathan L
Year of Publication 08.12.2022

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Device and method of very high density routing used with embedded multi-die interconnect bridge

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 22.11.2022

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 17.09.2020

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High density organic bridge device and method

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 02.06.2020

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DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 09.09.2021

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High density organic bridge device and method

by Lotz, Stephanie M, Roy, Mihir K, Jen, Wei-Lun Kane
Year of Publication 20.11.2019

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HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 17.01.2019

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MULTILAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD

by JEN, Wei-Lun Kane, JAIN, Padam, CHEN, Chi-Mon, SENEVIRATNE, Dilan
Year of Publication 16.09.2020

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High density organic bridge device and method

by Roy, Mihir K, Jen, Wei-Lun Kane, Lotz, Stefanie M
Year of Publication 16.10.2018

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Patent

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