A comparison of polymers and solder alloys by reliability tests on multi-layer redistribution lines in Fan Out Wafer Level Package
Hong-Da Chang, Jay Hsiao, Liu, Kenny, Hsu, H. S., You, Andrew, Ding, Carter, Pagala, Soriente Joshua, Zhu, Tammy, Chang, Ivan, Jiang, James, Cheng-An Chang, Sun, Tommy, Pan, George, Kao, Nicholas, Jase Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Leveraging information technology literacy to enhance college and career readiness for secondary students with disabilities
Lombardi, Allison, Izzo, Margo V., Gelbar, Nicholas, Murray, Alexa, Buck, Andrew, Johnson, Victor, Hsiao, Jay, Wei, Yan, Kowitt, Jennifer
Published in Journal of vocational rehabilitation (01.01.2017)
Published in Journal of vocational rehabilitation (01.01.2017)
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Journal Article