Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable Devices
Humi Tang, Max Lu, Jensen Tsai, Jase Jiang, Honda Cheng, Lu, Terrence, Yu-Po Wang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
A comparison of polymers and solder alloys by reliability tests on multi-layer redistribution lines in Fan Out Wafer Level Package
Hong-Da Chang, Jay Hsiao, Liu, Kenny, Hsu, H. S., You, Andrew, Ding, Carter, Pagala, Soriente Joshua, Zhu, Tammy, Chang, Ivan, Jiang, James, Cheng-An Chang, Sun, Tommy, Pan, George, Kao, Nicholas, Jase Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Flux study for ultra fine pitch flip chip packages
Wen-Hao Lee, Lin, G.T., Chang, D., Jiang, J., Chen, C.
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding