Search Results - "Japp, Robert" :: K.UTB vyhledávací portál

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Porous power and ground planes for reduced printed circuit boards delamination and better reliability

by JAPP ROBERT, POLIKS MARK
Year of Publication 02.12.2009

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Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I, Poliks, Mark D
Year of Publication 03.07.2012

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Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

by JAPP ROBERT M, POLIKS MARK D, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 03.07.2012

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Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

by JAPP ROBERT M, HARENDZA ROBERT J, BHATT ASHWINKUMAR C
Year of Publication 06.10.2009

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Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

by Bhatt, Ashwinkumar C, Harendza, Robert J, Japp, Robert M
Year of Publication 06.10.2009

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Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 09.07.2009

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Circuitized substrate with continuous thermoplastic support film dielectric layers

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I, Poliks, Mark D
Year of Publication 27.12.2011

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Circuitized substrate with continuous thermoplastic support film dielectric layers

by JAPP ROBERT M, POLIKS MARK D, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 27.12.2011

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Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

by Japp, Robert M, Memis, Irving, Papathomas, Kostas I
Year of Publication 30.12.2008

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Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

by JAPP ROBERT M, MEMIS IRVING, PAPATHOMAS KOSTAS I
Year of Publication 30.12.2008

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Porous power and ground planes for reduced PCB delamination and better reliability

by Japp, Robert M, Poliks, Mark D
Year of Publication 20.09.2005

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Porous power and ground planes for reduced PCB delamination and better reliability

by JAPP ROBERT M, POLIKS MARK D
Year of Publication 20.09.2005

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Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I
Year of Publication 30.09.2008

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Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same

by JAPP ROBERT M, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 30.09.2008

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Patent

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Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

by JAPP ROBERT M, MEMIS IRVING, PAPATHOMAS KOSTAS I
Year of Publication 26.08.2008

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Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

by Japp, Robert M, Memis, Irving, Papathomas, Kostas I
Year of Publication 26.08.2008

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METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

by JAPP ROBERT M, HARENDZA ROBERT J, BHATT ASHWINKUMAR C
Year of Publication 24.07.2008

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Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

by JAPP ROBERT M, HARENDZA ROBERT J, BHATT ASHWINKUMAR C
Year of Publication 17.07.2008

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Patent

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HALOGEN-FREE CIRCUIT BOARD WHEREIN THERMAL EXPANSION IS REDUCED, AND ITS MANUFACTURING METHOD

by JAPP ROBERT M, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 17.04.2008

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Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 03.04.2008

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