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Published in Sensors and actuators. B, Chemical (15.01.2022)
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The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40- \mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2019)
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The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-[Formula Omitted]m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection
Lee, SeYong, Lee, HanMin, Shin, SangMyung, Jang, MinGu, Choi, TaeJin, Kyung-Wook Paik
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
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Journal Article