Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation
Cinar, Yusuf, Jang, Jinwoo, Jang, Gunhee, Kim, Seonsik, Jang, Jaeseok, Chang, Jinkyu, Jun, Yonghyun
Published in Microelectronics and reliability (01.04.2012)
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LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION
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Module board and memory module including the same
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Year of Publication 06.12.2022
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MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
PARK, Hwanwook, JANG, Jaeseok, KIM, Dohyung, JANG, Dongmin, LEE, Jaekwang
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Year of Publication 05.05.2022
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Printed circuit board and semiconductor module including the same
Jang, Jaeseok, Park, Geunje, Kim, Dohyung, Jang, Dongmin, Seo, Dongyoon, Park, Hwanwook
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Year of Publication 12.09.2023
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PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
PARK, Geunje, SEO, Dongyoon, PARK, Hwanwook, KIM, Dohyung, JANG, Jaeseok, JANG, Dongmin
Year of Publication 19.05.2022
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Year of Publication 19.05.2022
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Module board and memory module including the same
JANG, JAESEOK, KIM, DOHYUNG, JANG, DONGMIN, PARK, HWANWOOK, LEE, JAEKWANG
Year of Publication 21.10.2023
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Year of Publication 21.10.2023
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