Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist
Janek, Florian, Eichhorn, Nadine, Weser, Sascha, Gläser, Kerstin, Eberhardt, Wolfgang, Zimmermann, André
Published in Micromachines (Basel) (21.07.2021)
Published in Micromachines (Basel) (21.07.2021)
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Journal Article
Feasibility Study of an Automated Assembly Process for Ultrathin Chips
Janek, Florian, Saller, Ebru, Müller, Ernst, Meißner, Thomas, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, André
Published in Micromachines (Basel) (30.06.2020)
Published in Micromachines (Basel) (30.06.2020)
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Journal Article
Assembly of Multiple Ultrathin Chips on Flexible Foils With High Placement Accuracy by a Simple Transfer Process
Janek, Florian, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, Andre
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2019)
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Journal Article
Recyclable in-mold and printed electronics with polymer separation layers
Brasse, Yannic, Laguna Moreno, Mariano, Blum, Simon, Horter, Tim, Janek, Florian, Gläser, Kerstin, Emmerechts, Carl, Clanet, Jean-Michel, Verhaert, Michèle, Grymonprez, Benoît, Kraus, Tobias
Published in RSC sustainability (05.06.2024)
Published in RSC sustainability (05.06.2024)
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Journal Article
3D-MID Evaluation and Validation for Space Applications
Hirt, Etienne, Ruzicka, Klaus, Wigger, Benedikt, Barth, Maximilian, Saleh, Rafat, Janek, Florian, Muller, Ernst
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing
Wolf, Marius, Janek, Florian, Meisner, Thomas, Wigger, Benedikt, Barth, Maximilian, Gunter, Thomas, Eberhardt, Wolfgang, Zimmermann, Andre, Geneis, Volker, Luke, Tobias, Hedayat, Christian, Otto, Thomas
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding