Thermal Characteristics of Chip Stack and Package Stack Memory Devices in the Component and Module Level
Heejin Lee, Haehyung Lee, Jaebeom Byun, Jin-yang Lee, Joonghyun Baek, Younghee Song
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
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