Numerical Analysis of Aerodynamic Characteristics of Hyperloop System
Oh, Jae-Sung, Kang, Taehak, Ham, Seokgyun, Lee, Kwan-Sup, Jang, Yong-Jun, Ryou, Hong-Sun, Ryu, Jaiyoung
Published in Energies (Basel) (06.02.2019)
Published in Energies (Basel) (06.02.2019)
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Journal Article
Inductive Design Exploration Method with Active Learning for Complex Design Problems
Jang, Sungwoo, Choi, Hae-Jin, Choi, Seung-Kyum, Oh, Jae-Sung
Published in Applied sciences (01.12.2018)
Published in Applied sciences (01.12.2018)
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Journal Article
High temperature oxidation behavior of Ni-Cr-Al based powder porous metal
Oh, Jae-Sung, Shim, Min-Chul, Park, Man-Ho, Lee, Kee-Ahn
Published in Metals and materials international (01.09.2014)
Published in Metals and materials international (01.09.2014)
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Journal Article
High Temperature Oxidation of Ni-Fe-Cr-Al Porous Metal
Choi, Sung-Hwan, Oh, Jae-Sung, Yun, Jung-Yeul, Kong, Young-Min, Kim, Byoung-Kee, Lee, Kee-Ahn
Published in Advanced engineering materials (01.03.2013)
Published in Advanced engineering materials (01.03.2013)
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Journal Article
분말 합금법으로 제조된 Ni-Cr-Al 초합금 다공체의 인장 특성에 미치는 변형률 속도 및 하중 방향 효과
김규식, Kyu-sik Kim, 배정석, Jung-suk Bae, 오재성, Jae-sung Oh, 이기안, Kee-ahn Lee
Published in 대한금속·재료학회지, 58(6) (05.06.2020)
Published in 대한금속·재료학회지, 58(6) (05.06.2020)
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Journal Article
Enhancing Efficiency in Bidirectional Resonant DC-DC Converter
Kim, Eun-Soo, Oh, Jae-Sung, Kim, Min-Ji, Lee, Jun-Hwan, Woo, Jung-Won, Jeon, Yong-Seog
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
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Conference Proceeding
Fe-Cr-Al계 분말 다공체 금속과 박판재의 고온 산화 거동
임선희, Seon Hui Lim, 오재성, Jae Sung Oh, 공영민, Young Min Kong, 김병기, Byung Kee Kim, 박만호, Man Ho Park, 이기안, Kee Ahn Lee
Published in 대한금속·재료학회지, 51(10) (20.10.2013)
Published in 대한금속·재료학회지, 51(10) (20.10.2013)
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Journal Article
포소화약제 혼합장치의 시험용 대체 약제에 관한 연구
정재한(Jae-Han Jung), 박승근(Seung-Geun Park), 임우섭(Woo-Sub Lim), 오재성(Jae-Sung Oh)
Published in 한국화재소방학회 논문지, 34(6) (30.12.2020)
Published in 한국화재소방학회 논문지, 34(6) (30.12.2020)
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Journal Article
The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering
Lee, Jeong Hwan, Ma, Sung Woo, Kim, Young Min, Lee, Jin Su, Kim, Ki Bum, Kim, Jae Myun, Oh, Jae Sung, Kim, Namseog, Kim, Young-Ho
Published in Journal of materials science. Materials in electronics (01.09.2013)
Published in Journal of materials science. Materials in electronics (01.09.2013)
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Journal Article
자궁내막암 환자의 외과적 수술 이후 발생한 후유증에 대한 한방치험 1례
고은비, Eun-bi Ko, 장권준, Kwon-jun Jang, 윤민지, Min-ji Yoon, 이지윤, Ji-yoon Lee, 양정민, Jung-min Yang, 오재성, Jae-sung Oh
Published in 大韓韓方婦人科學會誌 (25.11.2021)
Published in 大韓韓方婦人科學會誌 (25.11.2021)
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Journal Article
Reliability studies on micro-bumps for 3-D TSV integration
Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction
Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Chia, Pierre, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration
Young-Bae Park, Seung-Hyun Kim, Jong-Jin Park, Kim, June-Bum, Ho-Young Son, Kwon-Whan Han, Jae-Sung Oh, Nam-Seog Kim, Sehoon Yoo
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages
Ho-Young Son, Woong-Sun Lee, Seung-Kwon Noh, Min-Suk Suh, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding