Flip chip assembly challenges using high density, thin core carriers
Virendra Jadhav, Moore, S., Palomaki, C., Tran, S.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Esports and Merger & Acquisition
VIRENDRA JADHAV, VAISHNAVI, SHAH, PROF. SHITAL, KSHIRSAGAR, DR. ASHWINI
Published in INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT (08.01.2024)
Published in INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT (08.01.2024)
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Journal Article
A Monte Carlo Approach to Predicting Failure Across Multiple Temperature and Humidity Field Environments
Tucker, Jonathon, Dhakal, Ramji, Thiel, George, Jadhav, Virendra
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
STARTUPS -Requirement Factor in Finance
Jadhav, Vaishnavi Virendra
Published in INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT (20.05.2024)
Published in INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT (20.05.2024)
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Journal Article
Multilayer pillar for reduced stress interconnect and method of making same
Sundlof, Brian R, Semkow, Krystyna W, Srivastava, Kamalesh K, Jadhav, Virendra R
Year of Publication 08.02.2022
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Year of Publication 08.02.2022
Patent
Multilayer pillar for reduced stress interconnect and method of making same
Sundlof, Brian R, Semkow, Krystyna W, Srivastava, Kamalesh K, Jadhav, Virendra R
Year of Publication 17.08.2021
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Year of Publication 17.08.2021
Patent
THERMAL VENTING DEVICE WITH PRESSURIZED PLENUM
JADHAV, Virendra, DELANO, Andrew Douglas, BHOPTE, Siddharth, DUMMER, Daniel J
Year of Publication 20.09.2018
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Year of Publication 20.09.2018
Patent
Thermal venting device with pressurized plenum
Dummer, Daniel J, Bhopte, Siddharth, Delano, Andrew Douglas, Jadhav, Virendra
Year of Publication 31.07.2018
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Year of Publication 31.07.2018
Patent
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME
JADHAV, Virendra R, SRIVASTAVA, Kamalesh K, SUNDLOF, Brian R, SEMKOW, Krystyna W
Year of Publication 24.10.2019
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Year of Publication 24.10.2019
Patent
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME
JADHAV, Virendra R, SRIVASTAVA, Kamalesh K, SUNDLOF, Brian R, SEMKOW, Krystyna W
Year of Publication 24.10.2019
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Year of Publication 24.10.2019
Patent
Multilayer pillar for reduced stress interconnect and method of making same
Sundlof, Brian R, Semkow, Krystyna W, Srivastava, Kamalesh K, Jadhav, Virendra R
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent
Multilayer pillar for reduced stress interconnect and method of making same
Sundlof, Brian R, Semkow, Krystyna W, Srivastava, Kamalesh K, Jadhav, Virendra R
Year of Publication 27.08.2019
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Year of Publication 27.08.2019
Patent
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME
JADHAV, Virendra R, SRIVASTAVA, Kamalesh K, SUNDLOF, Brian R, SEMKOW, Krystyna W
Year of Publication 23.05.2019
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Year of Publication 23.05.2019
Patent
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME
SRIVASTAVA Kamalesh K, SUNDLOF Brian R, JADHAV Virendra R, SEMKOW Krystyna W
Year of Publication 15.06.2017
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Year of Publication 15.06.2017
Patent
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME
SRIVASTAVA Kamalesh K, SUNDLOF Brian R, JADHAV Virendra R, SEMKOW Krystyna W
Year of Publication 11.05.2017
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Year of Publication 11.05.2017
Patent
Multilayer pillar for reduced stress interconnect and method of making same
Srivastava Kamalesh K, Jadhav Virendra R, Sundlof Brian R, Semkow Krystyna W
Year of Publication 02.05.2017
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Year of Publication 02.05.2017
Patent