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"JUNGE, JOACHIM"
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"JUNGE, JOACHIM"
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반도체 재료로 제조된 원통형 로드로부터 디스크들을 생산하기 위한 방법
by
JUNGE JOACHIM
,
PIETSCH GEORG
Year of Publication
21.09.2023
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SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE
by
JUNGE JOACHIM
,
MOSER JOERG
Year of Publication
18.03.2013
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METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
by
Junge
,
Joachim
,
Pietsch, Georg
Year of Publication
11.07.2024
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METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
by
Junge
,
Joachim
,
Pietsch, Georg
Year of Publication
25.04.2024
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Method for producing wafers from a cylindrical ingot of semiconductor material
by
PIETSCH, GEORG
,
JUNGE
,
JOACHIM
Year of Publication
01.12.2022
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METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
by
JUNGE
,
Joachim
,
PIETSCH, Georg
Year of Publication
25.08.2022
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METHOD OF MANUFACTURING WAFERS FROM A CYLINDRICAL ROD OF SEMICONDUCTOR MATERIAL
by
Junge
,
Joachim
,
Pietsch, Georg
Year of Publication
24.08.2022
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SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE
by
JOERG MOSER
,
JOACHIM JUNGE
Year of Publication
30.04.2013
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WIRE SPOOLS FOR MULTIPLE WIRE SAWS FOR SLICING ONE OR MORE WAFERS FROM WORKPIECE
by
JOERG MOSER
,
JOACHIM JUNGE
Year of Publication
28.03.2013
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SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE
by
JUNGE JOACHIM
,
MOSER JOERG
Year of Publication
14.03.2013
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Simultaneous double-side grinding of semiconductor wafers
by
Junge
,
Joachim
,
Weiss, Robert
Year of Publication
12.06.2012
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Simultaneous double-side grinding of semiconductor wafers
by
WEISS ROBERT
,
JUNGE JOACHIM
Year of Publication
12.06.2012
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Method for grinding semiconductor wafers
by
Junge
,
Joachim
,
Weiss, Robert
Year of Publication
23.02.2010
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Method for grinding semiconductor wafers
by
WEISS ROBERT
,
JUNGE JOACHIM
Year of Publication
23.02.2010
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Simultanes doppelseitenschleifen von halbleiterscheiben
by
JUNGE
,
JOACHIM
Year of Publication
11.08.2012
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Verfahren zum schleifen von halbleiterscheiben
by
JUNGE
,
JOACHIM
Year of Publication
11.06.2012
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SIMULTANEOUS DOUBLE-SIDE GRINDING OF SEMICONDUCTOR WAFERS
by
WEISS ROBERT
,
JUNGE JOACHIM
Year of Publication
29.05.2009
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SIMULTANEOUS DOUBLE-SIDE GRINDING OF SEMICONDUCTOR WAFER
by
ROBERT WEISS
,
JUNGE JOACHIM
Year of Publication
07.05.2009
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Simultaneous Double-Side Grinding Of Semiconductor Wafers
by
WEISS ROBERT
,
JUNGE JOACHIM
Year of Publication
23.04.2009
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SIMULTANEOUS DOUBLE-SIDE GRINDING OF SEMICONDUCTOR WAFERS
by
WEISS ROBERT
,
JUNGE JOACHIM
Year of Publication
22.04.2009
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