Solder joint reliability with variations of solder ball land design
Young Hy Jung
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDOUCTOR PACKAGE
LEE, CHAN SUN, JUNG, YOUNG HY, KIM, KI CHAE, OH, JAE SUNG, CHOI, JAE YOUN, GWON, JIN HO, MOON, KI IL
Year of Publication 16.01.2012
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Year of Publication 16.01.2012
Patent
SUBSTRATE FOR SEMICONDOUCTOR PACKAGE AND METHODE THEREOF
LEE, CHAN SUN, JUNG, YOUNG HY, KIM, KI CHAE, OH, JAE SUNG, CHOI, JAE YOUN, GWON, JIN HO, MOON, KI IL
Year of Publication 17.05.2010
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Year of Publication 17.05.2010
Patent