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"JUNG HYE-YEONG"
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"JUNG HYE-YEONG"
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE
by
KIM JAE TAEK
,
JUNG HYE YEONG
Year of Publication
22.12.2021
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COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME
by
LIM JUN YOUNG
,
JUNG HYE YEONG
,
LEE SANG KYU
Year of Publication
25.07.2023
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SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
by
KIM JAE TAEK
,
JUNG HYE YEONG
Year of Publication
10.08.2021
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SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
by
KIM JAE TAEK
,
JUNG HYE YEONG
Year of Publication
09.08.2021
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
by
KIM JAE TAEK
,
JUNG HYE YEONG
Year of Publication
21.07.2021
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SEMICONDUCTOR MEMORY DEVICE
by
KIM JAE TAEK
,
JUNG HYE YEONG
Year of Publication
26.01.2021
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COIL MEMBER AND CAMERA MODULE HAVING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
12.07.2022
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COIL MEMBER FOR CORRECTING HAND-SHAKE AND CAMERA MODULE HAVING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
26.04.2021
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COIL MEMBER FOR CORRECTING HAND-SHAKE AND CAMERA MODULE HAVING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
26.04.2021
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COIL MEMBER FOR HAND-SHAKE CORRECTION, AND CAMERA MODULE INCLUDING SAME
by
JUNG
,
Hye Yeong
,
LEE, Seung Jin
,
YOON, Hyung Kyu
Year of Publication
22.04.2021
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COIL MEMBER FOR CORRECTING HAND-SHAKE AND CAMERA MODULE HAVING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
23.02.2021
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IMAGE STABILIZING COIL MEMBER AND CAMERA MODULE COMPRISING SAME
by
JUNG
,
Hye Yeong
,
LEE, Seung Jin
,
YOON, Hyung Kyu
Year of Publication
18.02.2021
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COIL MEMBER AND CAMERA MODULE COMPRISING SAME
by
JUNG
,
Hye Yeong
,
LEE, Seung Jin
,
OH, Jung Hun
,
YOON, Hyung Kyu
Year of Publication
07.07.2022
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3 3D Semiconductor Device Having A Support Pattern Being in Contact with A Sidewall of A Contact Plug
by
KIM JAE TAEK
,
JUNG HYE YEONG
,
LEE GO HYUN
Year of Publication
26.04.2022
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FLEXIBLE CIRCUIT BOARD AND CHIP PAKAGE COMPRISING THE SAME AND ELECTRONIC DEVICE COMPRISING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
20.03.2020
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SOFT CIRCUIT BOARD AND CHIP PACKAGE INCLUDING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME
by
LEE SEUNG JIN
,
YOON HYUNG KYU
,
JUNG HYE YEONG
Year of Publication
19.03.2020
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A device for forming a oxidization film of silicon wafer and A method for forming a oxidizaition film
by
JUNG
,
HYE YEONG
Year of Publication
20.05.2004
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Method for the analysis of the metallic impurities in silicon
by
JUNG
,
HYE YEONG
Year of Publication
15.02.2003
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LINE INTERFACE APPARATUS OF DS1 BOARD USING QUAD CHIP
by
JUNG
,
HYE YEONG
Year of Publication
26.06.2002
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APPARATUS FOR COLLECTION OF IMPURITIES OF SILICON WAFER
by
JUNG
,
HYE YEONG
Year of Publication
09.03.2002
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