Surface Control of Activated Carbon Fiber by Growth of Carbon Nanofiber
Lim, Seongyop, Yoon, Seong-Ho, Shimizu, Yoshiki, Jung, Hangi, Mochida, Isao
Published in Langmuir (22.06.2004)
Published in Langmuir (22.06.2004)
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Journal Article
An 8.5-Gb/s/Pin 12-Gb LPDDR5 SDRAM With a Hybrid-Bank Architecture, Low Power, and Speed-Boosting Techniques
Lee, Chang-Kyo, Chi, Hyung-Joon, Heo, Jin-Seok, Park, Jung-Hwan, Jang, Jin-Hun, Lee, Dongkeon, Jung, Jae-Hoon, Lee, Dong-Hun, Kim, Dae-Hyun, Kim, Kihan, Kim, Sang-Yun, Park, Dukha, Lim, Youngil, Park, Geuntae, Lee, Seung-Jun, Hong, Seungki, Kwon, Dae-Hyun, Hwang, Isak, Na, Byongwook, Kim, Kyung-Ryun, Choi, Seouk-Kyu, Choi, Hyein, Hangi-Jung, Bae, Won-Il, Ihm, Jeong-Don, Bae, Seung-Jun, Kim, Nam Sung, Lee, Jung-Bae
Published in IEEE journal of solid-state circuits (01.01.2021)
Published in IEEE journal of solid-state circuits (01.01.2021)
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Journal Article
ELECTRONIC CIRCUIT FOR OUPUTTING POST EMPHASIS SIGNAL
CHOI HUN DAE, KIM WANGSOO, PARK KIDUK, JUNG JAE HUN, SUNG YOO CHANG, CHO CHEONGRYONG, JUNG HANGI
Year of Publication 15.05.2019
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Year of Publication 15.05.2019
Patent
Enhancement of Thermal Transient Prediction Accuracy for Mobile AP Package
Park, Hwanjoo, Kim, Taehwan, Kang, Sunggu, Lee, Jonggyu, Mun, Sungho, Kim, Jaechoon, Jung, Hangi, Kim, Dongwook
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
Kim, Taehwan, Lee, Jonggyu, Kim, Youngdeuk, Park, Hwanjoo, Hwang, Heejung, Kim, Jaechoon, Jung, Hangi, Kim, Dong Wook
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding