A novel methodology for thermal characterization of power packages in high current applications
Lee, ByoungOk, A-Rom Moon, JoonSeo Son, JiHwan Kim
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Design and assembly process simulation for an automotive power module
Yong Liu, Qiuxiao Qian, Byoungok Lee, Taekkeun Lee, Joonseo Son, Oseob Jeon
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
Patent
Integrated circuit direct cooling systems having substrates in contact with a cooling medium
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 23.04.2024
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Year of Publication 23.04.2024
Patent
Semiconductor package and related methods
Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 15.06.2021
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Year of Publication 15.06.2021
Patent
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 24.03.2022
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Year of Publication 24.03.2022
Patent
Semiconductor package having a spacer with a junction cooling pipe
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 14.12.2021
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Year of Publication 14.12.2021
Patent
SEMICONDUCTOR PACKAGE AND RELATED METHODS
ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 26.08.2021
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Year of Publication 26.08.2021
Patent
Semiconductor package and related methods
Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent