Electronic package with high density interconnect layer
Downes, Jr., Francis J, Farquhar, Donald S, Foster, Elizabeth, Japp, Robert M, Jones, Gerald W, Kresge, John S, Sebesta, Robert D, Stone, David B, Wilcox, James R
Year of Publication 16.04.2002
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Year of Publication 16.04.2002
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Method of making circuitized substrate
HOUSER; DAVID E, JONES; GERALD W, POTTER; KENNETH L, BHATT; ASHWINKUMAR C, DUFFY; THOMAS P, MCKEVENY; JEFFREY
Year of Publication 04.02.1997
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Year of Publication 04.02.1997
Patent
Electronic package with high density interconnect layer
FARQUHAR DONALD S, JAPP ROBERT M, SEBESTA ROBERT D, JONES GERALD W, STONE DAVID B, FOSTER ELIZABETH, KRESGE JOHN S, WILCOX JAMES R, DOWNES, JR. FRANCIS J
Year of Publication 16.04.2002
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Year of Publication 16.04.2002
Patent
MULTILAYER INTERCONNECTION STRUCTURE AND ELECTRONIC PACKAGE
FARQUHAR DONALD S, DAVID B STONE, JOHN S KURIIJU, ROBERT D SEBESUTA, JONES GERALD W, DONS FRANCIS J JR, FOUST ELIZABETH, ROBERT M JAPPU, JAMES R WILCOCKS
Year of Publication 22.11.2001
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Year of Publication 22.11.2001
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IMPROVED INTEGRATED CIRCUIT STRUCTURE
FRANCIS J. DOWNES JR, JOHN S. KRESGE, CHERYL L. TYTRAN-PALOMAKI, DAVID J. ALCOE, GERALD W. JONES
Year of Publication 09.12.2005
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Year of Publication 09.12.2005
Patent