A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters
Li, Ke, Evans, Paul Leonard, Johnson, Christopher Mark, Videt, Arnaud, Idir, Nadir
Published in Energies (Basel) (09.04.2021)
Published in Energies (Basel) (09.04.2021)
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Journal Article
Accurate Measurement of Dynamic on-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter
Li, Ke, Videt, Arnaud, Idir, Nadir, Evans, Paul Leonard, Johnson, Christopher Mark
Published in IEEE transactions on power electronics (01.09.2020)
Published in IEEE transactions on power electronics (01.09.2020)
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Journal Article
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
Yaqub, Imran, Li, Jianfeng, Johnson, Christopher Mark
Published in Microelectronics and reliability (01.12.2015)
Published in Microelectronics and reliability (01.12.2015)
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Journal Article
Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects
Jianfeng Li, Castellazzi, Alberto, Tianxiang Dai, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark
Published in IEEE transactions on power electronics (01.05.2015)
Published in IEEE transactions on power electronics (01.05.2015)
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Journal Article
Development and Validation of a Smart Architecture for Thyristor Valves
Sala, G., De Bonis, G., Costabeber, A., Tani, A., Johnson, M., Clare, J.
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2023)
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2023)
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Journal Article
Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior
Jianfeng Li, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2017)
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Journal Article
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
Hui Zhang, Jianfeng Li, Jingru Dai, Corfield, Martin, Xuejian Liu, Yan Liu, Zhengren Huang, Johnson, Christopher Mark
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2018)
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2018)
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Journal Article
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark
Published in IEEE transactions on device and materials reliability (01.06.2018)
Published in IEEE transactions on device and materials reliability (01.06.2018)
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Magazine Article
MODULAR TRANSACTION TERMINAL ARCHITECTURE
Jendon, Terry, Snezek, JR., Carl Richard, Johnson, Mark Christopher, Cotha, Ajit Chetty
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates
Dai, Jingru, Li, Jianfeng, Mouawad, Bassem, Johnson, Christopher Mark
Published in 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (01.05.2018)
Published in 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (01.05.2018)
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Conference Proceeding