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"JOHANSSON GARY ALAN"
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"JOHANSSON GARY ALAN"
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Flowable compositions and use in filling vias and plated through-holes
by
JOHANSSON GARY ALAN
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
21.09.2004
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Flowable compositions and use in filling vias and plated through-holes
by
Johansson
,
Gary Alan
,
Papathomas, Konstantinos I
Year of Publication
21.09.2004
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DIE ATTACHMENT WITH REDUCED ADHESIVE BLEED-OUT
by
KONSTANTINOS I. PAPATHOMAS
,
GARY ALAN JOHANSSON
,
BERND KARL APPELT
Year of Publication
31.10.2007
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Flowable compositions and use in filling vias and plated through-holes
by
JOHANSSON GARY ALAN
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
03.04.2003
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Flowable compositions and use in filling vias and plated through-holes
by
Johansson
,
Gary Alan
,
Papathomas, Konstantinos I
Year of Publication
06.08.2002
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Flowable compositions and use in filling vias and plated through-holes
by
JOHANSSON GARY ALAN
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
06.08.2002
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Chip attachment with reduced adhesive bleed-out
by
KONSTANTINOS I. PAPATHOMAS
,
GARY ALAN JOHANSSON
,
BERND KARL APPELT
Year of Publication
26.01.2005
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Flowable compositions and use in filling vias and plated through-holes
by
PAPATHOMAS; KONSTANTINOS I
,
JOHANSSON
;
GARY ALAN
Year of Publication
18.07.2000
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Die attachment with reduced adhesive bleed-out
by
Appelt, Bernd Karl
,
Johansson
,
Gary Alan
,
Papathomas, Konstantinos I
Year of Publication
11.05.2004
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Die attachment with reduced adhesive bleed-out
by
JOHANSSON GARY ALAN
,
APPELT BERND KARL
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
11.05.2004
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Die attachment with reduced adhesive bleed-out
by
JOHANSSON GARY ALAN
,
APPELT BERND KARL
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
26.06.2003
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Process for filling apertures in a circuit board or chip carrier
by
Appelt, Bernd Karl
,
Johansson
,
Gary Alan
,
Papathomas, Konstantinos I
Year of Publication
18.03.2003
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Process for filling apertures in a circuit board or chip carrier
by
JOHANSSON GARY ALAN
,
APPELT BERND KARL
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
18.03.2003
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Process for filling apertures in a circuit board or chip carrier
by
JOHANSSON GARY ALAN
,
APPELT BERND KARL
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
19.07.2001
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Process for filling apertures in a circuit board or chip carrier
by
JOHANSSON GARY ALAN
,
APPELT BERND KARL
,
PAPATHOMAS KONSTANTINOS I
Year of Publication
01.05.2001
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Die attachment with reduced adhesive bleed-out
by
GARY ALAN JOHANSSON
,
BERND KARL APPELT
,
PAPATHOMAS, KONSTANTINOS, I
Year of Publication
03.11.2000
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Die attachment with reduced adhesive bleed-out
by
KONSTANTINOS I. PAPATHOMAS
,
GARY ALAN JOHANSSON
,
BERND KARL APPELT
Year of Publication
19.01.2000
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Patent
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basic electric elements
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