Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application
Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel
Published in Thin solid films (01.01.2014)
Published in Thin solid films (01.01.2014)
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Journal Article
Elastic MEMS probe card based on the PDMS substrate
Jing, Xiangmeng, Chen, Di, Huang, Chuang, Chen, Xiang, Miao, Jianmin, Liu, Jingquan, Zhu, Jun
Published in Journal of micromechanics and microengineering (01.05.2010)
Published in Journal of micromechanics and microengineering (01.05.2010)
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Journal Article
Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging
Sun, Zhanxing, Ding, Fei, Ma, Rui, Wang, Qidong, Jing, Xiangmeng, Su, Meiying, Cao, Liqiang
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Via last TSV process for wafer level packaging
Xiangmeng Jing, Fengwei Dai, Wenqi Zhang, Liqiang Cao
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Low Cost Wafer Level Packaging of MEMS Devices by Vertical Via-Last Process
Xiangmeng Jing, Fengwei Dai, Chunyan Zhang, Wenqi Zhang, Liqiang Cao
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Modeling and simulation of silicon wafer backside grinding process
Zhaoqiang Li, Xiangmeng Jing, Feng Jiang, Wenqi Zhang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Effect of thermal annealing on TSV Cu protrusion and local stress
Xiangmeng Jing, Hongwen He, Liang Ji, Cheng Xu, Kai Xue, Meiying Su, Chongshen Song, Daquan Yu, Liqiang Cao, Wenqi Zhang, Dongkai Shangguan
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques
Xiangmeng Jing, Daquan Yu, Lixi Wan
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications
Laicun Lin, Mingchuan Zhang, Delong Qiu, Xiangmeng Jing, Feng Jiang, Daquan Yu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Copper pumping of through silicon vias in reliability test
Xiangmeng Jing, Zhongcai Niu, Hu Hao, Wenqi Zhang, Ui-hyoung Lee
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Key process development on 300mm wafer for 2.5D/3D integration
Chongshen Song, Kai Xue, Feng Jiang, Hengfu Li, Guangjian Feng, Xiangmeng Jing, Zhang, W.
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
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Conference Proceeding
Effect of annealing after copper plating on the pumping behavior of through silicon vias
Liang Ji, Xiangmeng Jing, Kai Xue, Cheng Xu, Hongwen He, Wenqi Zhang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Influence of thermal annealing on the deformation of Cu-filled TSV
Hongwen He, Xiangmeng Jing, Liqiang Cao, Daquan Yu, Kai Xue, Wenqi Zhang
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding
Wafer level warpage characterization for backside manufacturing processes of TSV interposers
Feng Jiang, Qibin Wang, Kai Xue, Xiangmeng Jing, Daquan Yu, Dongkai Shangguan
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Investigation of temporary bonding and release processes for TSV with copper pillar bumps
Xiangmeng Jing, Feng Jiang, Cheng Xu, Kai Xue, Fengwei Dai, Zhaoqiang Li, Wenqi Zhang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications
Lin, Laicun, Jing, Xiangmeng, Wang, Qidong, Jiang, Feng, Cao, Liqiang, Yu, Daquan
Published in Microsystem technologies : sensors, actuators, systems integration (2016)
Published in Microsystem technologies : sensors, actuators, systems integration (2016)
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Journal Article