Airtight packaging assembly based on embedded micro-channel printed circuit board and preparation method thereof
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Year of Publication 08.11.2022
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Year of Publication 08.11.2022
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Interconnection structure and method of micro-channel interface in packaging structure body
WU YILONG, WEN ZEHAI, ZENG CE, PAN YUHUA, JI XINGQIAO, ZHANG JIAN, LU YINQUAN, XU RONGQING, LIU DAOLIN, XIANG WEIWEI
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Year of Publication 22.08.2023
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Method for controlling size of brazing seam in vacuum eutectic process
JIA BIN, WEN ZEHAI, GAO MINGQI, PAN YUHUA, JI XINGQIAO, LI WEN, CAO XUEJIAO, DU RONGFU, XU BING, XIANG WEIWEI
Year of Publication 16.09.2022
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Year of Publication 16.09.2022
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Precise tweezers for chip eutectic
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Year of Publication 09.08.2022
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Year of Publication 09.08.2022
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Universal eutectic device and eutectic method for automatic eutectic of multiple weldments
WU YILONG, JI XINGQIAO, LUO JIANQIANG, DAI ZHONG, ZHANG PINGSHENG, WANG HUI, WEN JUNLING
Year of Publication 29.01.2021
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Year of Publication 29.01.2021
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Multi-cavity LTCC substrate and packaging box body welding structure and method
WEN ZEHAI, JI XINGQIAO, ZHANG JIAN, DONG DONG, LU YINQUAN, XU RONGQING, LU QIAN, XIANG WEIWEI
Year of Publication 03.12.2021
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Year of Publication 03.12.2021
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Microwave assembly based on embedded micro-channel printed circuit board and preparation method
ZENG CE, WEN ZEHAI, XU NUOXIN, LAI JINMING, LU XI, JI XINGQIAO, ZHANG JIAN, ZHAO MING, WEN JIE, XIANG WEIWEI
Year of Publication 21.10.2022
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Year of Publication 21.10.2022
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Printed circuit board embedded with miniature flat heat pipe and packaging method thereof
ZENG CE, XU NUOXIN, JI XINGQIAO, ZHAO MING, ZHANG JIAN, YE HUIJIE, DONG DONG, XU RONGQING, LU QIAN, XIANG WEIWEI, BIAN FANGSHENG
Year of Publication 21.09.2021
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Year of Publication 21.09.2021
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Three-dimensional microwave component testing device
ZHOU LI, XU YANG, WU CHANGYONG, LAI JINMING, JI XINGQIAO, YU LEI, WANG CHAOJIE, JIE HAI, XU BING
Year of Publication 16.11.2018
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Year of Publication 16.11.2018
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