Investigation of interface delamination in a SO8 package under reflow
Yumin Liu, Yong Liu, Belani, S., Oseob Jeon
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
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Conference Proceeding
Design and assembly process simulation for an automotive power module
Yong Liu, Qiuxiao Qian, Byoungok Lee, Taekkeun Lee, Joonseo Son, Oseob Jeon
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding