MOULDED SEMICONDUCTOR PACKAGE WITH CAPACITIVE AND INDUCTIVE COMPONENTS
Kinzer, Daniel M, Estacio, Maria Cristina, Jeon, Oseob, Dube, Micheal M, Ullal, Vijay, Chiang, Justin, Ashrafzadeh, Ahmad, Wu, Chung-Lin
Year of Publication 29.07.2020
Get full text
Year of Publication 29.07.2020
Patent
MOULDED SEMICONDUCTOR PACKAGE WITH CAPACITIVE AND INDUCTIVE COMPONENTS
Kinzer, Daniel M, Estacio, Maria Cristina, Jeon, Oseob, Dube, Micheal M, Ullal, Vijay, Chiang, Justin, Ashrafzadeh, Ahmad, Wu, Chung-Lin
Year of Publication 13.05.2020
Get full text
Year of Publication 13.05.2020
Patent
SEMICONDUCTOR PACKAGES AND RELATED METHODS
ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 20.03.2019
Get full text
Year of Publication 20.03.2019
Patent
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 01.11.2018
Get full text
Year of Publication 01.11.2018
Patent
SEMICONDUCTOR PACKAGE AND RELATED METHODS
ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 08.03.2018
Get full text
Year of Publication 08.03.2018
Patent
Zweiseitiges direkt gekühltes Halbleiter-Package
Lee, Keunhyuk, Seddon, Michael J, Jeon, Oseob, Teysseyre, Jerome, Yoo, Inpil
Year of Publication 19.01.2023
Get full text
Year of Publication 19.01.2023
Patent
Semiconductor package, semiconductor package assembly and manufacturing method thereof
JEON OSEOB, TEYSSEYRE JEROME, INPIL YOO, LEE KEUNHYUK, SEDDON MICHAEL J
Year of Publication 17.01.2023
Get full text
Year of Publication 17.01.2023
Patent
IMMERSIONS-DIREKTKÜHLMODULE UND VERWANDTE VERFAHREN
Im, Seungwon, Seddon, Michael J, Jeon, Oseob, Ko, Youngsun, Teysseyre, Jerome
Year of Publication 22.12.2022
Get full text
Year of Publication 22.12.2022
Patent
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
JOSHI, RAJEEV, D, LEE BUYONG-OK, KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, IYER, VENKAT, NAM, SHIBACK, CHONG, DAVID, JEON , OSEOB, ESTACIO, MARIA CRISTINA B
Year of Publication 25.11.2020
Get full text
Year of Publication 25.11.2020
Patent
SEMICONDUCTOR PACKAGE AND RELATED METHODS
ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 21.12.2017
Get full text
Year of Publication 21.12.2017
Patent
Immersed direct cooling module and related methods
JEON OSEOB, IM SEUNG-WON, TISAYER, JU RG, GAO YINGXIAN, SEDDON MICHAEL J
Year of Publication 16.12.2022
Get full text
Year of Publication 16.12.2022
Patent
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT
KANG DONG-WOOK, KIM JUNG-DAE, JEON OSEOB, IM SEUNG-WON, KO YOUNG-SOON, YUN CHANGSHUN, KIM JI-HWAN
Year of Publication 17.10.2023
Get full text
Year of Publication 17.10.2023
Patent
Investigation of the assembly reflow process and PCB design on the reliability of WLCSP
Yong Liu, Qiuxiao Qian, Shichun Qu, Martin, S., Jeon, O.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding