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Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Porous SiOCH integration: etch challenges with a trench first metal hard mask approach
Possémé, Nicolas, David, Thibaut, Chevolleau, Thierry, Darnon, Maxime, Brun, Philippe, Guillermet, Marc, Oddou, Jean Pierre, Barnola, Sébastien, Bailly, Fanny, Bouyssou, Régis, Ducote, Julien, Hurand, Romain, Vérove, Christophe, Joubert, Olivier R.
Published in ECS transactions (2011)
Published in ECS transactions (2011)
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Year of Publication 17.08.2023
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METAL SHIELD TRENCHES AND METAL SUBSTRATE CONTACTS SUPPORTED WITHIN THE PREMETALLIZATION DIELECTRIC (PMD) LAYER OF AN INTEGRATED CIRCUIT USING A MIDDLE END OF LINE (MEOL) PROCESS
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Year of Publication 07.06.2018
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Year of Publication 12.04.2018
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Year of Publication 02.01.2018
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Year of Publication 02.01.2018
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NON-VOLATILE MEMORY CHIP BUILT INTO PHASE-CHANGE MATERIAL
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Year of Publication 16.06.2021
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COLOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
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Year of Publication 11.08.2016
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Back-illuminated integrated imaging device with simplified interconnect routing
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Year of Publication 20.06.2017
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Year of Publication 20.06.2017
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CHIP CONTAINING AN ONBOARD NON-VOLATILE MEMORY COMPRISING A PHASE-CHANGE MATERIAL
BRUN, Philippe, ODDOU, Jean-Pierre, BROUSSOUS, Lucile, ZOLL, Stephane, HINSINGER, Olivier, WEBER, Olivier, BOIVIN, Philippe, GALPIN, David, FAVENNEC, Laurent, ARNAUD, Franck, MORIN, Pierre
Year of Publication 09.05.2019
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Year of Publication 09.05.2019
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BACK-ILLUMINATED INTEGRATED IMAGING DEVICE WITH SIMPLIFIED INTERCONNECT ROUTING
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Year of Publication 07.04.2016
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Back side illumination image sensor with low dark current
ODDOU JEAN-PIERRE, ALLEGRET-MARET STEPHANE, GROS D'AILLON PATRICK, CARRERE JEAN-PIERRE
Year of Publication 29.12.2015
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Year of Publication 29.12.2015
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