Halbleiterbauelement mit einem Chip, der zwischen einer becherförmigen Leiterplatte und einer Leiterplatte mit Mesas und Tälern angeordnet ist, und Verfahren zur dessen Herstellung
Ou, Oscar, Mao, Sen, Wang, Peter, Jaunay, Serge Robert, Kuo, Frank, Kasem, Mohammed, Chen, Chang-Sheng
Year of Publication 17.11.2016
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Year of Publication 17.11.2016
Patent
Thermal analysis of power MOSFETs using Rebeca-3D thermal modeling software (from Epsilon Ingenierie) versus physical measurements and possible extractions
Pandya, K., Jaunay, S.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding