Wireless communicating nodes at 60 GHz integrated on flexible substrate for short-distance instrumentation in aeronautics and space
Jatlaoui, Mohamed Mehdi, Dragomirescu, Daniela, Ercoli, Mariano, Krämer, Michael, Charlot, Samuel, Pons, Patrick, Aubert, Hervé, Plana, Robert
Published in International journal of microwave and wireless technologies (01.02.2012)
Published in International journal of microwave and wireless technologies (01.02.2012)
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Journal Article
11.1 A Scalable Heterogeneous Integrated Two-Stage Vertical Power-Delivery Architecture for High-Performance Computing
Hardy, Casey, Pham, Hieu, Jatlaoui, Mohamed Mehdi, Voiron, Frederic, Xie, Tianshi, Chen, Po-Han, Jha, Saket, Mercier, Patrick, Le, Hanh-Phuc
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
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Conference Proceeding
Working principle description of the wireless passive EM transduction pressure sensor
Jatlaoui, M.M., Chebila, F., Pons, P., Aubert, H.
Published in European physical journal. Applied physics (01.10.2011)
Published in European physical journal. Applied physics (01.10.2011)
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Journal Article
Ultra-broadband Integrated Capacitive Silicon Interposer assembled with SnBi Eutectic Solder
Muller, Charles, Jatlaoui, Mohamed Mehdi, Pommier, Mickael
Published in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (05.10.2021)
Published in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (05.10.2021)
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Conference Proceeding
Pressure micro-sensor based on Radio-Frequency transducer
Jatlaoui, Mohamed Mehdi, Pons, Patrick, Aubert, Herve
Published in 2008 IEEE MTT-S International Microwave Symposium Digest (01.06.2008)
Published in 2008 IEEE MTT-S International Microwave Symposium Digest (01.06.2008)
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Conference Proceeding
Mechanical Robustness Study of Ultra Low Profile 3D Silicon Capacitors
Muller, Charles, Jatlaoui, Mohamed Mehdi, Lallemand, Florent, Abe, Shunsuke
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Wireless Sensing and Identification based on RADAR Cross Sections Variability Measurement of Passive Electromagnetic Sensors
Aubert, Hervé, Chebila, Franck, Jatlaoui, Mohamed Mehdi, Thai, Trang, Hallil, Hamida, Traille, Anya, Bouaziz, Sofiene, Rifai, Ayoub, Pons, Patrick, Menini, Philippe, Tentzeris, Manos
Published in Annales des télécommunications (14.06.2013)
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Published in Annales des télécommunications (14.06.2013)
Journal Article
Phenomenological theory and experimental characterizations of passive wireless EM pressure micro-sensor prototype
Jatlaoui, Mohamed Mehdi, Chebila, Franck, Idda, Tonio, Pons, Patrick, Aubert, Hervé
Published in 2010 IEEE Sensors (01.11.2010)
Published in 2010 IEEE Sensors (01.11.2010)
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Conference Proceeding
Multi-Terminal Low-ESL 3D Silicon Capacitors as Enabler for Optimized and Flat PDN Design
Jatlaoui, Mohamed Mehdi, Aubry, Yves, Muller, Charles, Kasai, Ryo, Takeuchi, Takashi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Vertical Power Delivery and Heterogeneous Integration for High-Performance Computing
Le, Hanh-Phuc, Hardy, Casey, Pham, Hieu, Jatlaoui, Mohamed Mehdi, Voiron, Frederic, Mercier, Patrick, Chen, Po-Han, Jha, Saket
Published in 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) (16.10.2023)
Published in 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) (16.10.2023)
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Conference Proceeding
Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling
Jatlaoui, Mohamed Mehdi, Hidaka, Seiji, Kasai, Ryo, Kubota, Sho, Takesawa, Masato, Muller, Charles, Lallemand, Florent, Abe, Shunsuke, Takeuchi, Takashi, Matsuno, Hitoshi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding