Search Results - "JAPP ROBERT M" :: K.UTB vyhledávací portál

Introducing Biobased Materials into the Electronics Industry

by Kosbar, Laura L., Gelorme, Jeffrey D., Japp, Robert M., Fotorny, William T.
Published in Journal of industrial ecology (01.07.2000)

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Journal Article

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Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates

by JAPP ROBERT M, PAPATHOMAS KOSTAS I
Year of Publication 25.08.2011

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Patent

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Method of making halogen-free circuitized substrate with reduced thermal expansion

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 06.08.2013

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Patent

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Power core for use in circuitized substrate and method of making same

by Japp, Robert M, Papathomas, Kostas, Kresge, John Steven, Antesberger, Timothy
Year of Publication 12.06.2012

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Patent

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Power core for use in circuitized substrate and method of making same

by JAPP ROBERT M, KRESGE JOHN STEVEN, PAPATHOMAS KOSTAS, ANTESBERGER TIMOTHY
Year of Publication 12.06.2012

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Patent

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METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

by JAPP ROBERT M, PAPATHOMAS KOSTAS I, PALOMAKI CHERYL
Year of Publication 19.01.2012

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Patent

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POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

by JAPP ROBERT M, PAPATHOMAS KOSTAS, KRESGE JOHN S, ANTESBERGER TIMOTHY
Year of Publication 24.11.2011

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Patent

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Dielectric composition for use in circuitized substrates and circuitized substrate including same

by JAPP ROBERT M, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 26.04.2011

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Patent

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Dielectric composition for use in circuitized substrates and circuitized substrate including same

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I
Year of Publication 26.04.2011

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Patent

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Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 30.03.2010

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Patent

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Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

by Japp, Robert M, Markovich, Voya R, Papthomas, Kostas I
Year of Publication 30.03.2010

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Patent

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Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I, Poliks, Mark D
Year of Publication 03.07.2012

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Patent

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Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

by JAPP ROBERT M, POLIKS MARK D, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 03.07.2012

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Patent

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Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

by JAPP ROBERT M, HARENDZA ROBERT J, BHATT ASHWINKUMAR C
Year of Publication 06.10.2009

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Patent

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Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

by Bhatt, Ashwinkumar C, Harendza, Robert J, Japp, Robert M
Year of Publication 06.10.2009

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Patent

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LOW CTE POWER AND GROUND PLANES

by ROBERT M. JAPP, MARK D. POLIKS
Year of Publication 30.08.2006

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Patent

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POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY

by ROBERT M. JAPP, MARK D. POLIKS
Year of Publication 31.07.2006

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Patent

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Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 09.07.2009

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Patent

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Circuitized substrate with continuous thermoplastic support film dielectric layers

by Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I, Poliks, Mark D
Year of Publication 27.12.2011

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Patent

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Circuitized substrate with continuous thermoplastic support film dielectric layers

by JAPP ROBERT M, POLIKS MARK D, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Year of Publication 27.12.2011

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Patent

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